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BibTeX records: Shou-Chung Lee
@inproceedings{DBLP:conf/irps/ChenLOL18, author = {Pin{-}Shiang Chen and Shou{-}Chung Lee and A. S. Oates and Chee Wee Liu}, title = {{BEOL} {TDDB} reliability modeling and lifetime prediction using critical energy to breakdown}, booktitle = {{IEEE} International Reliability Physics Symposium, {IRPS} 2018, Burlingame, CA, USA, March 11-15, 2018}, pages = {6}, publisher = {{IEEE}}, year = {2018}, url = {https://doi.org/10.1109/IRPS.2018.8353626}, doi = {10.1109/IRPS.2018.8353626}, timestamp = {Wed, 16 Oct 2019 14:14:55 +0200}, biburl = {https://dblp.org/rec/conf/irps/ChenLOL18.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
@inproceedings{DBLP:conf/irps/OngLO18, author = {Yi Ching Ong and Shou{-}Chung Lee and A. S. Oates}, title = {Percolation defect nucleation and growth as a description of the statistics of electrical breakdown for gate, {MOL} and {BEOL} dielectrics}, booktitle = {{IEEE} International Reliability Physics Symposium, {IRPS} 2018, Burlingame, CA, USA, March 11-15, 2018}, pages = {7--1}, publisher = {{IEEE}}, year = {2018}, url = {https://doi.org/10.1109/IRPS.2018.8353667}, doi = {10.1109/IRPS.2018.8353667}, timestamp = {Tue, 22 Jan 2019 00:00:00 +0100}, biburl = {https://dblp.org/rec/conf/irps/OngLO18.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
@inproceedings{DBLP:conf/irps/LeeO15, author = {Shou{-}Chung Lee and A. S. Oates}, title = {On the voltage dependence of copper/low-k dielectric breakdown}, booktitle = {{IEEE} International Reliability Physics Symposium, {IRPS} 2015, Monterey, CA, USA, April 19-23, 2015}, pages = {3}, publisher = {{IEEE}}, year = {2015}, url = {https://doi.org/10.1109/IRPS.2015.7112699}, doi = {10.1109/IRPS.2015.7112699}, timestamp = {Wed, 16 Oct 2019 14:14:55 +0200}, biburl = {https://dblp.org/rec/conf/irps/LeeO15.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
@article{DBLP:journals/mr/OatesL06, author = {A. S. Oates and Shou{-}Chung Lee}, title = {Electromigration failure distributions of dual damascene Cu /low - k interconnects}, journal = {Microelectron. Reliab.}, volume = {46}, number = {9-11}, pages = {1581--1586}, year = {2006}, url = {https://doi.org/10.1016/j.microrel.2006.07.038}, doi = {10.1016/J.MICROREL.2006.07.038}, timestamp = {Sat, 22 Feb 2020 00:00:00 +0100}, biburl = {https://dblp.org/rec/journals/mr/OatesL06.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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