Jan Van Olmen

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

◀ ▶ joint publications with F. Ling

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Publications

2010
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Y. Yang, Riet Labie, F. Ling, C. Zhao, A. Radisic, Jan Van Olmen, Youssef Travaly, Bert Verlinden, Ingrid De Wolf:
Processing assessment and adhesion evaluation of copper through-silicon vias (TSVs) for three-dimensional stacked-integrated circuit (3D-SIC) architectures. Microelectron. Reliab. 50(9-11): 1636-1640 (2010)

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