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R. L. J. M. Ubachs

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Journal Articles

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2010
[j3]
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R. L. J. M. Ubachs:
Electromigration in WLCSP solder bumps. Microelectron. Reliab. 50(9-11): 1678-1683 (2010)
2006
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R. L. J. M. Ubachs, Olaf van der Sluis, W. D. van Driel, G. Q. Zhang:
Multiscale modelling of multilayer substrates. Microelectron. Reliab. 46(9-11): 1472-1477 (2006)
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W. D. van Driel, Olaf van der Sluis, Dao-Guo Yang, R. L. J. M. Ubachs, C. Zenz, G. Aflenzer, G. Q. Zhang:
Reliability modelling for packages in flexible end-products. Microelectron. Reliab. 46(9-11): 1880-1885 (2006)

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