BibTeX record conf/dac/GoplenS07

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@inproceedings{DBLP:conf/dac/GoplenS07,
  author       = {Brent Goplen and
                  Sachin S. Sapatnekar},
  title        = {Placement of 3D ICs with Thermal and Interlayer Via Considerations},
  booktitle    = {Proceedings of the 44th Design Automation Conference, {DAC} 2007,
                  San Diego, CA, USA, June 4-8, 2007},
  pages        = {626--631},
  publisher    = {{IEEE}},
  year         = {2007},
  url          = {https://doi.org/10.1145/1278480.1278637},
  doi          = {10.1145/1278480.1278637},
  timestamp    = {Tue, 06 Nov 2018 16:58:19 +0100},
  biburl       = {https://dblp.org/rec/conf/dac/GoplenS07.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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