BibTeX record conf/iccad/ZhangJLS13

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@inproceedings{DBLP:conf/iccad/ZhangJLS13,
  author       = {Chun Zhang and
                  Moongon Jung and
                  Sung Kyu Lim and
                  Yiyu Shi},
  editor       = {J{\"{o}}rg Henkel},
  title        = {Novel crack sensor for TSV-based 3D integrated circuits: design and
                  deployment perspectives},
  booktitle    = {The {IEEE/ACM} International Conference on Computer-Aided Design,
                  ICCAD'13, San Jose, CA, USA, November 18-21, 2013},
  pages        = {371--378},
  publisher    = {{IEEE}},
  year         = {2013},
  url          = {https://doi.org/10.1109/ICCAD.2013.6691145},
  doi          = {10.1109/ICCAD.2013.6691145},
  timestamp    = {Tue, 13 Dec 2022 14:39:07 +0100},
  biburl       = {https://dblp.org/rec/conf/iccad/ZhangJLS13.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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