BibTeX record conf/irps/FarooqRCPGKCLOL15

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@inproceedings{DBLP:conf/irps/FarooqRCPGKCLOL15,
  author    = {Mukta G. Farooq and
               G. La Rosa and
               Fen Chen and
               Prakash Periasamy and
               Troy L. Graves{-}abe and
               Chandrasekharan Kothandaraman and
               C. Collins and
               W. Landers and
               J. Oakley and
               J. Liu and
               John Safran and
               S. Ghosh and
               S. Mittl and
               D. Ioannou and
               Carole Graas and
               Daniel Berger and
               Subramanian S. Iyer},
  title     = {Impact of 3D copper {TSV} integration on 32SOI {FEOL} and {BEOL} reliability},
  booktitle = {{IEEE} International Reliability Physics Symposium, {IRPS} 2015, Monterey,
               CA, USA, April 19-23, 2015},
  pages     = {4},
  year      = {2015},
  crossref  = {DBLP:conf/irps/2015},
  url       = {https://doi.org/10.1109/IRPS.2015.7112732},
  doi       = {10.1109/IRPS.2015.7112732},
  timestamp = {Sun, 21 May 2017 00:17:26 +0200},
  biburl    = {https://dblp.org/rec/bib/conf/irps/FarooqRCPGKCLOL15},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@proceedings{DBLP:conf/irps/2015,
  title     = {{IEEE} International Reliability Physics Symposium, {IRPS} 2015, Monterey,
               CA, USA, April 19-23, 2015},
  publisher = {{IEEE}},
  year      = {2015},
  url       = {http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=7106273},
  isbn      = {978-1-4673-7362-3},
  timestamp = {Mon, 07 Mar 2016 09:32:18 +0100},
  biburl    = {https://dblp.org/rec/bib/conf/irps/2015},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
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