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BibTeX record journals/isafm/ChienLJ06
@article{DBLP:journals/isafm/ChienLJ06, author = {Chen{-}Fu Chien and Huan{-}Chung Li and Angus Jeang}, title = {Data mining for improving the solder bumping process in the semiconductor packaging industry}, journal = {Intell. Syst. Account. Finance Manag.}, volume = {14}, number = {1-2}, pages = {43--57}, year = {2006}, url = {https://doi.org/10.1002/isaf.273}, doi = {10.1002/ISAF.273}, timestamp = {Tue, 04 Oct 2022 16:42:32 +0200}, biburl = {https://dblp.org/rec/journals/isafm/ChienLJ06.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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