BibTeX record journals/mr/ChenQACXS16

download as .bib file

@article{DBLP:journals/mr/ChenQACXS16,
  author       = {Si Chen and
                  Fei Qin and
                  Tong An and
                  Pei Chen and
                  Bin Xie and
                  Xunqing Shi},
  title        = {Protrusion of electroplated copper filled in through silicon vias
                  during annealing process},
  journal      = {Microelectron. Reliab.},
  volume       = {63},
  pages        = {183--193},
  year         = {2016},
  url          = {https://doi.org/10.1016/j.microrel.2016.04.005},
  doi          = {10.1016/J.MICROREL.2016.04.005},
  timestamp    = {Tue, 21 Mar 2023 21:14:33 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/ChenQACXS16.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
a service of  Schloss Dagstuhl - Leibniz Center for Informatics

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.