BibTeX record journals/mr/ChuangAD06

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@article{DBLP:journals/mr/ChuangAD06,
  author       = {Cheng{-}Li Chuang and
                  Jong{-}Ning Aoh and
                  Rong{-}Fong Din},
  title        = {Oxidation of copper pads and its influence on the quality of Au/Cu
                  bonds during thermosonic wire bonding process},
  journal      = {Microelectron. Reliab.},
  volume       = {46},
  number       = {2-4},
  pages        = {449--458},
  year         = {2006},
  url          = {https://doi.org/10.1016/j.microrel.2005.01.010},
  doi          = {10.1016/J.MICROREL.2005.01.010},
  timestamp    = {Thu, 14 Oct 2021 09:38:39 +0200},
  biburl       = {https://dblp.org/rec/journals/mr/ChuangAD06.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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