BibTeX record journals/mr/Liu03

download as .bib file

@article{DBLP:journals/mr/Liu03,
  author       = {Johan Liu},
  title        = {Foldable Flex and Thinned Silicon Chips for Multichip Packaging; John
                  Balde (Ed.), Kluwer Academic Publishers, Boston, USA, December 2002.
                  Hardbound, 340 pp, Number of figures and tables 200, {ISBN} 0-7923-7676-5},
  journal      = {Microelectron. Reliab.},
  volume       = {43},
  number       = {4},
  pages        = {681--683},
  year         = {2003},
  url          = {https://doi.org/10.1016/S0026-2714(03)00033-7},
  doi          = {10.1016/S0026-2714(03)00033-7},
  timestamp    = {Sat, 22 Feb 2020 19:29:02 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/Liu03.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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