BibTeX record journals/mr/ParkO06

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@article{DBLP:journals/mr/ParkO06,
  author       = {Jongwoo Park and
                  John Osenbach},
  title        = {Processability and reliability of epoxy adhesive used in microelectronic
                  devices linked to effects of degree of cure and damp heat aging},
  journal      = {Microelectron. Reliab.},
  volume       = {46},
  number       = {2-4},
  pages        = {503--511},
  year         = {2006},
  url          = {https://doi.org/10.1016/j.microrel.2005.05.010},
  doi          = {10.1016/J.MICROREL.2005.05.010},
  timestamp    = {Sat, 22 Feb 2020 19:28:59 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/ParkO06.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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