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BibTeX record journals/mr/TsaiCLH06
@article{DBLP:journals/mr/TsaiCLH06, author = {M. Y. Tsai and W. C. Chiang and T. M. Liu and G. H. Hsu}, title = {Thermal deformation measurements and predictions of {MAP-BGA} electronic packages}, journal = {Microelectron. Reliab.}, volume = {46}, number = {2-4}, pages = {476--486}, year = {2006}, url = {https://doi.org/10.1016/j.microrel.2005.02.014}, doi = {10.1016/J.MICROREL.2005.02.014}, timestamp = {Sat, 22 Feb 2020 19:27:40 +0100}, biburl = {https://dblp.org/rec/journals/mr/TsaiCLH06.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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