BibTeX record journals/mr/UllanLCBCGMMPP06

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@article{DBLP:journals/mr/UllanLCBCGMMPP06,
  author       = {Miguel Ull{\'{a}}n and
                  Manuel Lozano and
                  Mokhtar Chmeissani and
                  G. Blanchot and
                  Enric Cabruja and
                  J. Garc{\'{\i}}a and
                  M. Maiorino and
                  Ricardo Mart{\'{\i}}nez and
                  Giulio Pellegrini and
                  Carles Puigdengoles},
  title        = {Test structure assembly for bump bond yield measurement on high density
                  flip chip technologies},
  journal      = {Microelectron. Reliab.},
  volume       = {46},
  number       = {7},
  pages        = {1095--1100},
  year         = {2006},
  url          = {https://doi.org/10.1016/j.microrel.2005.10.001},
  doi          = {10.1016/J.MICROREL.2005.10.001},
  timestamp    = {Thu, 05 Nov 2020 14:01:17 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/UllanLCBCGMMPP06.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}