"Contactless Stacked-die Testing for Pre-bond Interposers."

Jui-Hung Chien et al. (2014)

> Home

Details and statistics

DOI: 10.1145/2593069.2593111

access: closed

type: Conference or Workshop Paper

metadata version: 2025-09-28

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/dac/ChienHLYC14
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/dac/ChienHLYC14
Jui-Hung Chien, Ruei-Siang Hsu, Hsueh-Ju Lin, Ka-Yi Yeh, Shih-Chieh Chang:
Contactless Stacked-die Testing for Pre-bond Interposers. DAC 2014: 8:1-8:6

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.