"Transient Simulations of Three-Dimensional Integrated Circuit Interconnect ..."

Mike Chou, Tom Korsmeyer, Jacob White (1995)

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DOI: 10.1145/217474.217575

access: closed

type: Conference or Workshop Paper

metadata version: 2023-04-29

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Mike Chou, Tom Korsmeyer, Jacob White:
Transient Simulations of Three-Dimensional Integrated Circuit Interconnect Using a Mixed Surface-Volume Approach. DAC 1995: 485-490

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