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"TSV open defects in 3D integrated circuits: characterization, test, and ..."

Fangming Ye, Krishnendu Chakrabarty (2012)

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DOI: 10.1145/2228360.2228545

access: closed

type: Conference or Workshop Paper

metadata version: 2022-01-03

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Fangming Ye, Krishnendu Chakrabarty:
TSV open defects in 3D integrated circuits: characterization, test, and optimal spare allocation. DAC 2012: 1024-1030

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