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"Robust TSV-based 3D NoC design to counteract electromigration and ..."

Sourav Das et al. (2017)

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DOI: 10.23919/DATE.2017.7927205

access: closed

type: Conference or Workshop Paper

metadata version: 2022-01-03

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  dblp key:
  - conf/date/DasDPC17
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  persistent URL:
  - https://dblp.org/rec/conf/date/DasDPC17
Sourav Das, Janardhan Rao Doppa, Partha Pratim Pande, Krishnendu Chakrabarty:
Robust TSV-based 3D NoC design to counteract electromigration and crosstalk noise. DATE 2017: 1366-1371

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