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"Metal layer planning for silicon interposers with consideration of ..."

Wen-Hao Liu, Tzu-Kai Chien, Ting-Chi Wang (2014)

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DOI: 10.7873/DATE.2014.372

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-23

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  persistent URL:
  - https://dblp.org/rec/conf/date/LiuCW14
Wen-Hao Liu, Tzu-Kai Chien, Ting-Chi Wang:
Metal layer planning for silicon interposers with consideration of routability and manufacturing cost. DATE 2014: 1-6

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