"Recovery-aware proactive TSV repair for electromigration in 3D ICs."

Shengcheng Wang et al. (2017)

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DOI: 10.23919/DATE.2017.7926986

access: closed

type: Conference or Workshop Paper

metadata version: 2017-08-14

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  persistent URL:
  - https://dblp.org/rec/conf/date/WangZTT17
Shengcheng Wang, Hengyang Zhao, Sheldon X.-D. Tan, Mehdi Baradaran Tahoori:
Recovery-aware proactive TSV repair for electromigration in 3D ICs. DATE 2017: 220-225

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