ISPD 2025: Austin, TX, USA

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Session 1: Opening Session and First Keynote

Session 2: Placement and DTCO

Session 3: Acceleration

Session 4: Panel on Heterogenous Integration

Session 5: Emerging Technologies

Session 6: Reliability

Session 7: Retrospective and Prospective of Physical Design

Session 8: Second Keynote

Session 9: AI for Chip Design

Session 10: LLM for Chip Design

Session 11: Cell Design

Session 12: 3D IC Part I

Session 13: Lifetime Achievement Session

Session 14: Third Keynote

Session 15: 3D IC Part II

Session 16: Contest Results and Closing Remarks