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International Conference on Technical Debt (TechDebt)

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is part of: International Conference on Software Engineering (ICSE)

TechDebt 2025: Ottawa, ON, Canada

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IEEE/ACM International Conference on Technical Debt, TechDebt@ICSE 2025, Ottawa, ON, Canada, April 27-28, 2025. IEEE 2025, ISBN 979-8-3315-0221-8 [contents]

TechDebt 2024: Lisbon, Portugal

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Matthias Galster, Zadia Codabux, Rodrigo O. Spínola:
Proceedings of the 7th ACM/IEEE International Conference on Technical Debt, TechDebt 2024, Lisbon, Portugal, April 14-15, 2024. ACM 2024 [contents]

TechDebt 2023: Melbourne, Australia

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2023 ACM/IEEE International Conference on Technical Debt (TechDebt), Melbourne, Australia, May 14-15, 2023. IEEE 2023, ISBN 979-8-3503-1194-5 [contents]

TechDebt 2022: Pittsburgh, PA, USA

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Neil A. Ernst, Valentina Lenarduzzi, Tushar Sharma:
TechDebt '22: International Conference on Technical Debt, Pittsburgh Pennsylvania, May 17-18, 2022. ACM 2022, ISBN 978-1-4503-9304-1 [contents]

TechDebt 2021: Madrid, Spain

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4th IEEE/ACM International Conference on Technical Debt, TechDebt@ICSE 2021, Madrid, Spain, May 19-21, 2021. IEEE 2021, ISBN 978-1-6654-1405-0 [contents]

TechDebt 2020: Seoul, Korea

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Clemente Izurieta, Matthias Galster, Michael Felderer:
TechDebt '20: International Conference on Technical Debt, Seoul, Republic of Korea, June 28-30, 2020. ACM 2020, ISBN 978-1-4503-7960-1 [contents]

TechDebt 2019: Montreal, QC, Canada

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Paris Avgeriou, Klaus Schmid:
Proceedings of the Second International Conference on Technical Debt, TechDebt@ICSE 2019, Montreal, QC, Canada, May 26-27, 2019. IEEE / ACM 2019, ISBN 978-1-7281-3371-3 [contents]

TechDebt 2018: Gothenburg, Sweden

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Robert L. Nord, Frank Buschmann, Philippe Kruchten:
Proceedings of the 2018 International Conference on Technical Debt, TechDebt@ICSE 2018, Gothenburg, Sweden, May 27-28, 2018. ACM 2018 [contents]

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