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ORCIDIEEE Micro, Volume 44
Volume 44, Number 1, January - February 2024
- Hsien-Hsin S. Lee
:
Computing With COOL Chips. 4-5 - Ryusuke Egawa, Yasutaka Wada:
Special Issue on COOL Chips. 6-7 - Reon Oshio, Sugahara Takuya, Atsushi Sawada, Mutsumi Kimura, Renyuan Zhang, Yasuhiko Nakashima:
A Compressed Spiking Neural Network Onto a Memcapacitive In-Memory Computing Array. 8-16 - Donghyeon Han, Junha Ryu, Sangyeob Kim, Sangjin Kim, Jongjun Park, Hoi-Jun Yoo:
A Low-Power Artificial-Intelligence-Based 3-D Rendering Processor With Hybrid Deep Neural Network Computing. 17-27 - Sangyeob Kim, Soyeon Kim, Seongyon Hong, Sangjin Kim, Jiwon Choi, Donghyeon Han, Hoi-Jun Yoo:
COOL-NPU: Complementary Online Learning Neural Processing Unit. 28-37 - Tatsuya Kubo, Shinya Takamaeda-Yamazaki:
Cachet: Low-Overhead Integrity Verification on Metadata Cache in Secure Nonvolatile Memory Systems. 38-48 - Jianqing Liu, Na Gong:
Privacy by Memory Design: Visions and Open Problems. 49-58 - Cyrius Nugier, Vincent Migliore:
Acceleration of a Classic McEliece Postquantum Cryptosystem With Cache Processing. 59-68 - Joshua J. Yi:
Analysis of Historical Patenting Behavior and Patent Characteristics of Computer Architecture Companies - Part VIII: Patent Families. 70-74 - Shane Greenstein:
After the Gold Rush. 76-78
Volume 44, Number 2, March - April 2024
- Hsien-Hsin S. Lee:
Beyond Wires: The Future of Interconnects. 4-5 - Scott Levy, Whit Schonbein:
Special Issue on Hot Interconnects 30. 6-7 - Yuke Li, Arjun Kashyap, Yanfei Guo, Xiaoyi Lu:
Compression Analysis for BlueField-2/-3 Data Processing Units: Lossy and Lossless Perspectives. 8-19 - Rafael Oliveira, Ada Gavrilovska:
Comprex: In-Network Compression for Accelerating IoT Analytics at Scale. 20-30 - Liuyao Dai, Hao Qi, Weicong Chen, Xiaoyi Lu:
High-Speed Data Communication With Advanced Networks in Large Language Model Training. 31-40 - Dennis Abts, John Kim:
Enabling Artificial Intelligence Supercomputers With Domain-Specific Networks. 41-49 - Debendra Das Sharma, Swadesh Choudhary:
Pipelined and Partitionable Forward Error Correction and Cyclic Redundancy Check Circuitry Implementation for PCI Express 6.0 and Compute Express Link 3.0. 50-59 - Huseyin Ekin Sumbul, Jae-sun Seo, Daniel H. Morris, Edith Beigné:
A Fully Digital and Row-Pipelined Compute-in-Memory Neural Network Accelerator With System-on-Chip-Level Benchmarking for Augmented/Virtual Reality Applications. 61-70 - Joshua J. Yi:
Analysis of Historical Patenting Behavior and Patent Characteristics of Computer Architecture Companies - Part IX: Patent Families. 72-77 - Shane Greenstein:
Party Like It's 1999? 78-80
Volume 44, Number 3, May - June 2024
- Hsien-Hsin S. Lee:
An Incoming World of Decoupling Siliconomy. 4-5 - Heiner Litz, Natalia Vassilieva:
Special Issue on Hot Chips 2023. 6-7 - Ravi Bhargava, Kai Troester:
AMD Next-Generation "Zen 4" Core and 4th Gen AMD EPYC Server CPUs. 8-17 - Mahesh Subramony, David Kramer, Indrani Paul:
AMD Ryzen 7040 Series. 18-24 - Jason Howard, Joshua B. Fryman, Shamsul Abedin:
The First Direct Mesh-to-Mesh Photonic Fabric. 25-32 - Amir Gholami, Zhewei Yao, Sehoon Kim, Coleman Hooper, Michael W. Mahoney, Kurt Keutzer:
AI and Memory Wall. 33-39 - Byeongho Kim, Sanghoon Cha, Sangsoo Park, Jieun Lee, Sukhan Lee, Shinhaeng Kang, Jinin So, Kyungsoo Kim, Jin Jung, Jong-Geon Lee, Sunjung Lee, Yoonah Paik, Hyeonsu Kim, Jin-Seong Kim, Won-Jo Lee, Yuhwan Ro, Yeongon Cho, Jin Hyun Kim, Joon-Ho Song, Jaehoon Yu, Seungwon Lee, Jeonghyeon Cho, Kyomin Sohn:
The Breakthrough Memory Solutions for Improved Performance on LLM Inference. 40-48 - Sean Lie:
Inside the Cerebras Wafer-Scale Cluster. 49-57 - Ian Winfield, Tim Ouradnik, Joseph Madril, Michael Matthews, Guillermo Romero:
High-Performance Cooling for Power Electronics via Electrochemical Additive Manufacturing. 58-66 - Michael Gibbs, Kieran Woodward, Eiman Kanjo:
Combining Multiple Tiny Machine Learning Models for Multimodal Context-Aware Stress Recognition on Constrained Microcontrollers. 67-75 - Joshua J. Yi:
Analysis of Historical Patenting Behavior and Patent Characteristics of Computer Architecture Companies - Part X: Patent Families. 76-80 - Shane M. Greenstein:
The Worlds I See: Curiosity, Exploration, and the Discovery at the Dawn of AI - Fei-Fei Li (New York, NY, USA: Flatiron Books, 2023, 336 pp.). 82-84
Volume 44, Number 4, July - August 2024
- Hsien-Hsin S. Lee:
Top Picks Ignite Innovation. 4-5 - Yan Solihin:
Special Issue on Top Picks From the 2023 Computer Architecture Conferences. 6-10 - Kuan-Chieh Hsu, Hung-Wei Tseng:
Simultaneous and Heterogenous Multithreading: Exploiting Simultaneous and Heterogeneous Parallelism in Accelerator-Rich Architectures. 11-19 - Ajeya Naithani, Jaime Roelandts, Sam Ainsworth, Timothy M. Jones, Lieven Eeckhout:
Decoupled Vector Runahead for Prefetching Nested Memory-Access Chains. 20-26 - Björn Gottschall, Lieven Eeckhout, Magnus Jahre:
Per-Instruction Cycle Stacks Through Time-Proportional Event Analysis. 27-33 - Mingyu Liang, Yu Gan, Yueying Li, Carlos Torres, Abhishek Dhanotia, Mahesh Ketkar, Christina Delimitrou:
End-to-End Cloud Application Cloning With Ditto. 34-43 - Kaiyang Zhao, Kaiwen Xue, Ziqi Wang, Dan Schatzberg, Leon Yang, Antonis Manousis, Johannes Weiner, Rik van Riel, Bikash Sharma, Chunqiang Tang, Dimitrios Skarlatos:
Contiguitas: The Pursuit of Physical Memory Contiguity in Data Centers. 44-51 - Jaehyun Han, Krishnan Gosakan, William Kuszmaul, Ibrahim N. Mubarek, Nirjhar Mukherjee, Karthik Sriram, Guido Tagliavini, Evan West, Michael A. Bender, Abhishek Bhattacharjee, Alex Conway, Martín Farach-Colton, Jayneel Gandhi, Rob Johnson, Sudarsun Kannan, Donald E. Porter:
Mosaic Pages: Big TLB Reach With Small Pages. 52-59 - Haocong Luo, Ataberk Olgun, Abdullah Giray Yaglikçi, Yahya Can Tugrul, Steve Rhyner, Meryem Banu Cavlak, Joël Lindegger, Mohammad Sadrosadati, Onur Mutlu:
RowPress Vulnerability in Modern DRAM Chips. 60-69 - Shravan Narayan, Tal Garfinkel, Mohammadkazem Taram, Joey Rudek, Daniel Moghimi, Evan Johnson, Chris Fallin, Anjo Vahldiek-Oberwagner, Michael LeMay, Ravi Sahita, Dean M. Tullsen, Deian Stefan:
Hardware-Assisted Fault Isolation: Going Beyond the Limits of Software-Based Sandboxing. 70-79 - Gerasimos Gerogiannis, Josep Torrellas:
Practical Online Reinforcement Learning for Microprocessors With Micro-Armed Bandit. 80-87 - Nathaniel Bleier, Abigail Wezelis, Lav R. Varshney, Rakesh Kumar:
Programmable Olfactory Computing. 88-96 - Seah Kim, Jerry Zhao, Krste Asanovic, Borivoje Nikolic, Yakun Sophia Shao:
AuRORA: A Full-Stack Solution for Scalable and Virtualized Accelerator Integration. 97-105 - Raghavendra Pradyumna Pothukuchi, Karthik Sriram, Michal Gerasimiuk, Muhammed Ugur, Rajit Manohar, Anurag Khandelwal, Abhishek Bhattacharjee:
Distributed Brain-Computer Interfacing With a Networked Multiaccelerator Architecture. 106-115 - Joshua J. Yi:
Analysis of Historical Patenting Behavior and Patent Characteristics of Computer Architecture Companies - Part XI: Patent Families. 116-120 - Shane Greenstein:
Navigating Applications Development in Generative AI. 122-124
Volume 44, Number 5, September - October 2024
- Hsien-Hsin S. Lee:
The Path to Powering Intelligence. 4-5 - John L. Hennessy, Christos Kozyrakis, Gabriel Falcão:
Special Issue on The Past, Present, and Future of Warehouse-Scale Computing. 6-7 - John L. Hennessy:
Luiz André Barroso: Brilliant Engineer, Humble Leader, and Mentor. 8-10 - Parthasarathy Ranganathan, Urs Hölzle:
Twenty Five Years of Warehouse-Scale Computing. 11-22 - Leah Shalev, Hani Ayoub, Nafea Bshara, Yuval Fatael, Ori Golan, Omer Ilany, Anna Levin, Zorik Machulsky, Kevin Milczewski, Marc Olson, Valentin Priescu, Shyam Rajagopal, Ali Saidi:
The Tail at Amazon Web Services Scale. 23-29 - Ricardo Bianchini, Christian Belady, Anand Sivasubramaniam:
Data Center Power and Energy Management: Past, Present, and Future. 30-36 - Carole-Jean Wu, Bilge Acun, Ramya Raghavendra, Kim M. Hazelwood:
Beyond Efficiency: Scaling AI Sustainably. 37-46 - Yiquan Chen, Yuan Xie, Yijing Wang, Jiexiong Xu, Zhen Jin, Anyu Li, Xiaoyan Fu, Qiang Liu, Wenzhi Chen:
Optimizing NVMe Storage for Large-Scale Deployment: Key Technologies and Strategies in Alibaba Cloud. 47-56 - Christina Delimitrou, Michael Marty:
Tales of the Tail: Past and Future. 57-64 - Babak Falsafi, Michael Ferdman, Boris Grot:
Server Architecture From Enterprise to Post-Moore. 65-73 - Andrei Bersatti, Euna Kim, Hyesoon Kim:
Quantifying CO2 Emission Reduction Through Spatial Partitioning in Deep Learning Recommendation System Workloads. 75-82 - Joshua J. Yi:
Analysis of Historical Patenting Behavior and Patent Characteristics of Computer Architecture Companies - Part XII: Patent Families. 83-88 - Shane Greenstein:
Commercial and Scientific Prototypes. 90-92
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