Stop the war!Остановите войну!
for scientists:
default search action
Google
Google Scholar
Semantic Scholar
Internet Archive Scholar
CiteSeerX
ORCIDBibTeX records: Mitsumasa Koyanagi
@inproceedings{DBLP:conf/3dic/MurugesanSSMKF23,
author = {Mariappan Murugesan and
M. Sawa and
E. Sone and
Makoto Motoyoshi and
Mitsumasa Koyanagi and
Takafumi Fukushima},
title = {Copper Electrode Surface Features and Cu-SiO2Hybrid Bonding},
booktitle = {{IEEE} International 3D Systems Integration Conference, 3DIC 2023,
Cork, Ireland, May 10-12, 2023},
pages = {1--4},
publisher = {{IEEE}},
year = {2023},
url = {https://doi.org/10.1109/3DIC57175.2023.10154924},
doi = {10.1109/3DIC57175.2023.10154924},
timestamp = {Mon, 10 Jul 2023 15:09:43 +0200},
biburl = {https://dblp.org/rec/conf/3dic/MurugesanSSMKF23.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/ShenLHSKTMKF23,
author = {Jiayi Shen and
Chang Liu and
Tadaaki Hoshi and
Atsushi Sinoda and
Hisashi Kino and
Tetsu Tanaka and
Mariappan Murugesan and
Mitsumasa Koyanagi and
Takafumi Fukushima},
title = {Impact of Super-long-throw {PVD} on {TSV} Metallization and Die-to-Wafer
3D Integration Based on Via-last},
booktitle = {{IEEE} International 3D Systems Integration Conference, 3DIC 2023,
Cork, Ireland, May 10-12, 2023},
pages = {1--4},
publisher = {{IEEE}},
year = {2023},
url = {https://doi.org/10.1109/3DIC57175.2023.10154930},
doi = {10.1109/3DIC57175.2023.10154930},
timestamp = {Mon, 10 Jul 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/ShenLHSKTMKF23.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/FukushimaSTHBMK21,
author = {Takafumi Fukushima and
Shinichi Sakuyama and
Masatomo Takahashi and
Hiroyuki Hashimoto and
Jichoel Bea and
Theodorus Marcello and
Hisashi Kino and
Tetsu Tanaka and
Mitsumasa Koyanagi and
Mariappan Murugesan},
title = {Integration of Damage-less Probe Cards Using Nano-TSV Technology for
Microbumped Wafer Testing},
booktitle = {{IEEE} International 3D Systems Integration Conference, 3DIC 2021,
Raleigh, NC, USA, October 26-29, 2021},
pages = {1--4},
publisher = {{IEEE}},
year = {2021},
url = {https://doi.org/10.1109/3DIC52383.2021.9687601},
doi = {10.1109/3DIC52383.2021.9687601},
timestamp = {Fri, 18 Feb 2022 10:36:41 +0100},
biburl = {https://dblp.org/rec/conf/3dic/FukushimaSTHBMK21.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/HorioOKK21,
author = {Yoshihiko Horio and
Takemori Orima and
Koji Kiyoyama and
Mitsumasa Koyanagi},
title = {Implementation of a Chaotic Neural Network Reservoir on a TSV/{\textdollar}{\textbackslash}mu{\textbackslash}text\{Bump\}{\textdollar}
Stacked 3D Cyclic Neural Network Integrated Circuit},
booktitle = {{IEEE} International 3D Systems Integration Conference, 3DIC 2021,
Raleigh, NC, USA, October 26-29, 2021},
pages = {1--4},
publisher = {{IEEE}},
year = {2021},
url = {https://doi.org/10.1109/3DIC52383.2021.9687614},
doi = {10.1109/3DIC52383.2021.9687614},
timestamp = {Wed, 23 Feb 2022 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/HorioOKK21.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/KiyoyamaHFHOK21,
author = {Koji Kiyoyama and
Yoshihiko Horio and
Takafumi Fukushima and
Hiroyuki Hashimoto and
Takemori Orima and
Mitsumasa Koyanagi},
title = {Design for 3-D Stacked Neural Network Circuit with Cyclic Analog Computing},
booktitle = {{IEEE} International 3D Systems Integration Conference, 3DIC 2021,
Raleigh, NC, USA, October 26-29, 2021},
pages = {1--4},
publisher = {{IEEE}},
year = {2021},
url = {https://doi.org/10.1109/3DIC52383.2021.9687608},
doi = {10.1109/3DIC52383.2021.9687608},
timestamp = {Wed, 23 Feb 2022 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/KiyoyamaHFHOK21.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/MurugesanSSMSFK21,
author = {Mariappan Murugesan and
E. Sone and
A. Simomura and
Makoto Motoyoshi and
M. Sawa and
K. Fukuda and
Mitsumasa Koyanagi and
Takafumi Fukushima},
title = {Cu-Cu Direct Bonding Through Highly Oriented Cu Grains for 3D-LSI
Applications},
booktitle = {{IEEE} International 3D Systems Integration Conference, 3DIC 2021,
Raleigh, NC, USA, October 26-29, 2021},
pages = {1--4},
publisher = {{IEEE}},
year = {2021},
url = {https://doi.org/10.1109/3DIC52383.2021.9687604},
doi = {10.1109/3DIC52383.2021.9687604},
timestamp = {Fri, 18 Feb 2022 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/MurugesanSSMSFK21.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/vlsi-dat/Koyanagi20,
author = {Mitsumasa Koyanagi},
title = {3D Heterogeneous Integration Technology for {AI} System},
booktitle = {2020 International Symposium on {VLSI} Design, Automation and Test,
{VLSI-DAT} 2020, Hsinchu, Taiwan, August 10-13, 2020},
pages = {1},
publisher = {{IEEE}},
year = {2020},
url = {https://doi.org/10.1109/VLSI-DAT49148.2020.9196249},
doi = {10.1109/VLSI-DAT49148.2020.9196249},
timestamp = {Tue, 29 Sep 2020 11:35:15 +0200},
biburl = {https://dblp.org/rec/conf/vlsi-dat/Koyanagi20.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/KurookaHNKF19,
author = {Shunji Kurooka and
Yoshinori Hotta and
Ai Nakamura and
Mitsumasa Koyanagi and
Takafumi Fukushima},
title = {Cu-Cu Bonding Challenges with 'i-ACF' for Advanced 3D Integration},
booktitle = {2019 International 3D Systems Integration Conference (3DIC), Sendai,
Japan, October 8-10, 2019},
pages = {1--4},
publisher = {{IEEE}},
year = {2019},
url = {https://doi.org/10.1109/3DIC48104.2019.9058773},
doi = {10.1109/3DIC48104.2019.9058773},
timestamp = {Sun, 19 Apr 2020 18:46:53 +0200},
biburl = {https://dblp.org/rec/conf/3dic/KurookaHNKF19.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/MurugesanKF19,
author = {Mariappan Murugesan and
Mitsumasa Koyanagi and
Takafumi Fukushima},
title = {Growth Optimization of Multi-Layer Graphene for Thermal-TSV Application
in 3D-LSI},
booktitle = {2019 International 3D Systems Integration Conference (3DIC), Sendai,
Japan, October 8-10, 2019},
pages = {1--5},
publisher = {{IEEE}},
year = {2019},
url = {https://doi.org/10.1109/3DIC48104.2019.9058853},
doi = {10.1109/3DIC48104.2019.9058853},
timestamp = {Sun, 19 Apr 2020 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/MurugesanKF19.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/MurugesanKHBF19,
author = {Mariappan Murugesan and
Mitsumasa Koyanagi and
Hiroyuki Hashimoto and
Ji Chel Bea and
Takafumi Fukushima},
title = {Fabrication and Morphological Characterization of Nano-Scale Interconnects
for 3D-Integration},
booktitle = {2019 International 3D Systems Integration Conference (3DIC), Sendai,
Japan, October 8-10, 2019},
pages = {1--4},
publisher = {{IEEE}},
year = {2019},
url = {https://doi.org/10.1109/3DIC48104.2019.9058849},
doi = {10.1109/3DIC48104.2019.9058849},
timestamp = {Sun, 19 Apr 2020 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/MurugesanKHBF19.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/micromachines/FukushimaHYKMBL16,
author = {Takafumi Fukushima and
Hideto Hashiguchi and
Hiroshi Yonekura and
Hisashi Kino and
Mariappan Murugesan and
Ji Chel Bea and
Kang Wook Lee and
Tetsu Tanaka and
Mitsumasa Koyanagi},
title = {Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary
Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration},
journal = {Micromachines},
volume = {7},
number = {10},
pages = {184},
year = {2016},
url = {https://doi.org/10.3390/mi7100184},
doi = {10.3390/MI7100184},
timestamp = {Thu, 14 Oct 2021 01:00:00 +0200},
biburl = {https://dblp.org/rec/journals/micromachines/FukushimaHYKMBL16.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/FukushimaMOHBLT16,
author = {Takafumi Fukushima and
Mariappan Murugesan and
Shin Ohsaki and
Hiroyuki Hashimoto and
Jichoel Bea and
Kang Wook Lee and
Tetsu Tanaka and
Mitsumasa Koyanagi},
title = {New concept of {TSV} formation methodology using Directed Self-Assembly
{(DSA)}},
booktitle = {2016 {IEEE} International 3D Systems Integration Conference, 3DIC
2016, San Francisco, CA, USA, November 8-11, 2016},
pages = {1--4},
publisher = {{IEEE}},
year = {2016},
url = {https://doi.org/10.1109/3DIC.2016.7970022},
doi = {10.1109/3DIC.2016.7970022},
timestamp = {Tue, 16 Feb 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/FukushimaMOHBLT16.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/LeeNBFRWTK16,
author = {Kang Wook Lee and
Ai Nakamura and
Jicheol Bea and
Takafumi Fukushima and
Suresh Ramalingam and
Xin Wu and
Tanaka Tanaka and
Mitsumasa Koyanagi},
title = {Nano-scale Cu direct bonding using ultra-high density Cu nano-pillar
{(CNP)} for high yield exascale 2.5/3D integration applications},
booktitle = {2016 {IEEE} International 3D Systems Integration Conference, 3DIC
2016, San Francisco, CA, USA, November 8-11, 2016},
pages = {1--5},
publisher = {{IEEE}},
year = {2016},
url = {https://doi.org/10.1109/3DIC.2016.7970027},
doi = {10.1109/3DIC.2016.7970027},
timestamp = {Tue, 16 Feb 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/LeeNBFRWTK16.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/MotoyoshiYFTMAK16,
author = {Makoto Motoyoshi and
Kohki Yanagimura and
Taikoh Fushimi and
Junichi Takanohashi and
Mariappan Murugesan and
Masahiro Aoyagi and
Mitsumasa Koyanagi},
title = {3 Dimensional stacked pixel detector and sensor technology using less
than 3-{\(\mu\)}m{\(\varphi\)} robust bump junctions},
booktitle = {2016 {IEEE} International 3D Systems Integration Conference, 3DIC
2016, San Francisco, CA, USA, November 8-11, 2016},
pages = {1--4},
publisher = {{IEEE}},
year = {2016},
url = {https://doi.org/10.1109/3DIC.2016.7970029},
doi = {10.1109/3DIC.2016.7970029},
timestamp = {Thu, 13 Jul 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/MotoyoshiYFTMAK16.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/MurugesanBFMTK16,
author = {Mariappan Murugesan and
Jichel Bea and
Takafumi Fukushima and
Makoto Motoyoshi and
Tetsu Tanaka and
Mitsumasa Koyanagi},
title = {Improving the integrity of Ti barrier layer in Cu-TSVs through self-formed
TiSix for via-last {TSV} technology},
booktitle = {2016 {IEEE} International 3D Systems Integration Conference, 3DIC
2016, San Francisco, CA, USA, November 8-11, 2016},
pages = {1--4},
publisher = {{IEEE}},
year = {2016},
url = {https://doi.org/10.1109/3DIC.2016.7970017},
doi = {10.1109/3DIC.2016.7970017},
timestamp = {Fri, 27 Dec 2019 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/MurugesanBFMTK16.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/ieiceee/Koyanagi15,
author = {Mitsumasa Koyanagi},
title = {Recent progress in 3D integration technology},
journal = {{IEICE} Electron. Express},
volume = {12},
number = {7},
pages = {20152001},
year = {2015},
url = {https://doi.org/10.1587/elex.12.20152001},
doi = {10.1587/ELEX.12.20152001},
timestamp = {Fri, 12 Feb 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/ieiceee/Koyanagi15.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/LeeNNABKHFT15,
author = {K. W. Lee and
Chisato Nagai and
Ai Nakamura and
Hiroki Aizawa and
Ji Chel Bea and
Mitsumasa Koyanagi and
Hideto Hashiguchi and
Takafumi Fukushima and
Tanaka Tanaka},
title = {Reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology
for ultra-high density 3D integration using recessed oxide, thin glue
adhesive, and thin metal capping layers},
booktitle = {2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai,
Japan, August 31 - September 2, 2015},
pages = {TS1.2.1--TS1.2.4},
publisher = {{IEEE}},
year = {2015},
url = {https://doi.org/10.1109/3DIC.2015.7334471},
doi = {10.1109/3DIC.2015.7334471},
timestamp = {Mon, 06 Sep 2021 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/LeeNNABKHFT15.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/TanikawaKFKT15,
author = {Seiya Tanikawa and
Hisashi Kino and
Takafumi Fukushima and
Mitsumasa Koyanagi and
Tetsu Tanaka},
title = {Novel local stress evaluation method in 3D {IC} using {DRAM} cell
array with planar mOS capacitors},
booktitle = {2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai,
Japan, August 31 - September 2, 2015},
pages = {TS3.1.1--TS3.1.4},
publisher = {{IEEE}},
year = {2015},
url = {https://doi.org/10.1109/3DIC.2015.7334557},
doi = {10.1109/3DIC.2015.7334557},
timestamp = {Thu, 14 Oct 2021 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/TanikawaKFKT15.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/YanDCLFK15,
author = {Yangyang Yan and
Yingtao Ding and
Qianwen Chen and
Kang Wook Lee and
Takafumi Fukushima and
Mitsumasa Koyanagi},
title = {Vacuum-assisted-spin-coating of polyimide liner for high-aspect-ratio
TSVs applications},
booktitle = {2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai,
Japan, August 31 - September 2, 2015},
pages = {TS5.2.1--TS5.2.5},
publisher = {{IEEE}},
year = {2015},
url = {https://doi.org/10.1109/3DIC.2015.7334568},
doi = {10.1109/3DIC.2015.7334568},
timestamp = {Tue, 16 Feb 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/YanDCLFK15.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/FukushimaSHNBHM15,
author = {Takafumi Fukushima and
Taku Suzuki and
Hideto Hashiguchi and
Chisato Nagai and
Jichoel Bea and
Hiroyuki Hashimoto and
Mariappan Murugesan and
Kang Wook Lee and
Tetsu Tanaka and
Kazushi Asami and
Yasuhiro Kitamura and
Mitsumasa Koyanagi},
title = {Transfer and non-transfer stacking technologies based on chip-to-wafer
self-asembly for high-throughput and high-precision alignment and
microbump bonding},
booktitle = {2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai,
Japan, August 31 - September 2, 2015},
pages = {TS7.4.1--TS7.4.4},
publisher = {{IEEE}},
year = {2015},
url = {https://doi.org/10.1109/3DIC.2015.7334578},
doi = {10.1109/3DIC.2015.7334578},
timestamp = {Tue, 16 Feb 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/FukushimaSHNBHM15.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/KinoHTSIFKT15,
author = {Hisashi Kino and
Hideto Hashiguchi and
Seiya Tanikawa and
Yohei Sugawara and
Shunsuke Ikegaya and
Takafumi Fukushima and
Mitsumasa Koyanagi and
Tetsu Tanaka},
title = {Consideration of microbump layout for reduction of local bending stress
due to {CTE} Mismatch in 3D {IC}},
booktitle = {2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai,
Japan, August 31 - September 2, 2015},
pages = {TS8.26.1--TS8.26.4},
publisher = {{IEEE}},
year = {2015},
url = {https://doi.org/10.1109/3DIC.2015.7334596},
doi = {10.1109/3DIC.2015.7334596},
timestamp = {Thu, 14 Oct 2021 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/KinoHTSIFKT15.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/irps/LeeBMFTK15,
author = {Kang Wook Lee and
Ji Chel Bea and
Mariappan Murugesan and
Takafumi Fukushima and
Tetsu Tanaka and
Mitsumasa Koyanagi},
title = {Impacts of 3-D integration processes on device reliabilities in thinned
{DRAM} chip for 3-D {DRAM}},
booktitle = {{IEEE} International Reliability Physics Symposium, {IRPS} 2015, Monterey,
CA, USA, April 19-23, 2015},
pages = {4},
publisher = {{IEEE}},
year = {2015},
url = {https://doi.org/10.1109/IRPS.2015.7112733},
doi = {10.1109/IRPS.2015.7112733},
timestamp = {Tue, 16 Feb 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/irps/LeeBMFTK15.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/FukushimaIMBLCT14,
author = {Takafumi Fukushima and
Yuka Ito and
Mariappan Murugesan and
Jicheol Bea and
Kang Wook Lee and
Koji Choki and
Tetsu Tanaka and
Mitsumasa Koyanagi},
title = {Tiny {VCSEL} chip self-assembly for advanced chip-to-wafer 3D and
hetero integration},
booktitle = {2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale,
Ireland, December 1-3, 2014},
pages = {1--4},
publisher = {{IEEE}},
year = {2014},
url = {https://doi.org/10.1109/3DIC.2014.7152145},
doi = {10.1109/3DIC.2014.7152145},
timestamp = {Tue, 16 Feb 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/FukushimaIMBLCT14.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/LeeNNBMFTK14,
author = {K. W. Lee and
Chisato Nagai and
Ai Nakamura and
Ji Chel Bea and
Mariappan Murugesan and
Takafumi Fukushima and
Tanaka Tanaka and
Mitsumasa Koyanagi},
title = {Effects of electro-less Ni layer as barrier/seed layers for high reliable
and low cost Cu {TSV}},
booktitle = {2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale,
Ireland, December 1-3, 2014},
pages = {1--4},
publisher = {{IEEE}},
year = {2014},
url = {https://doi.org/10.1109/3DIC.2014.7152153},
doi = {10.1109/3DIC.2014.7152153},
timestamp = {Fri, 27 Dec 2019 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/LeeNNBMFTK14.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/FukushimaBMLK13,
author = {Takafumi Fukushima and
Jichoel Bea and
Mariappan Murugesan and
Kang Wook Lee and
Mitsumasa Koyanagi},
title = {Development of via-last 3D integration technologies using a new temporary
adhesive system},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--4},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702383},
doi = {10.1109/3DIC.2013.6702383},
timestamp = {Tue, 16 Feb 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/FukushimaBMLK13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/FukushimaBMSSBKLK13,
author = {Takafumi Fukushima and
Jichoel Bea and
Mariappan Murugesan and
Ho{-}Young Son and
M.{-}S. Suh and
K.{-}Y. Byun and
N.{-}S. Kim and
Kang Wook Lee and
Mitsumasa Koyanagi},
title = {3D memory chip stacking by multi-layer self-assembly technology},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--4},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702360},
doi = {10.1109/3DIC.2013.6702360},
timestamp = {Tue, 16 Feb 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/FukushimaBMSSBKLK13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/HashimotoFLKT13,
author = {Hiroyuki Hashimoto and
Takafumi Fukushima and
Kang Wook Lee and
Mitsumasa Koyanagi and
Tetsu Tanaka},
title = {Highly efficient {TSV} repair technology for resilient 3-D stacked
multicore processor system},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--5},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702338},
doi = {10.1109/3DIC.2013.6702338},
timestamp = {Tue, 16 Feb 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/HashimotoFLKT13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/KiyoyamaSHLFTK13,
author = {Kouji Kiyoyama and
Y. Sato and
Hiroyuki Hashimoto and
Kang Wook Lee and
Takafumi Fukushima and
Tetsu Tanaka and
Mitsumasa Koyanagi},
title = {A block-parallel {ADC} with digital noise cancelling for 3-D stacked
{CMOS} image sensor},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--4},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702363},
doi = {10.1109/3DIC.2013.6702363},
timestamp = {Tue, 16 Feb 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/KiyoyamaSHLFTK13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/LeeTMNBFTK13,
author = {Kang Wook Lee and
Seiya Tanikawa and
Mariappan Murugesan and
H. Naganuma and
Jichoel Bea and
Takafumi Fukushima and
Tetsu Tanaka and
Mitsumasa Koyanagi},
title = {Impact of 3-D integration process on memory retention characteristics
in thinned {DRAM} chip for 3-D memory},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--4},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702336},
doi = {10.1109/3DIC.2013.6702336},
timestamp = {Tue, 16 Feb 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/LeeTMNBFTK13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/MurugesanBLFTKSWK13,
author = {Mariappan Murugesan and
Jichoel Bea and
Kang Wook Lee and
Takafumi Fukushima and
Tetsu Tanaka and
Mitsumasa Koyanagi and
Yuji Sutou and
H. Wang and
J. Koike},
title = {Effect of {CVD} Mn oxide layer as Cu diffusion barrier for {TSV}},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--4},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702364},
doi = {10.1109/3DIC.2013.6702364},
timestamp = {Tue, 16 Feb 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/MurugesanBLFTKSWK13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/isscc/ShibataKH12,
author = {Noboru Shibata and
Kazushige Kanda and
Toshiki Hisada and
Katsuaki Isobe and
Manabu Sato and
Yui Shimizu and
Takahiro Shimizu and
Takahiro Sugimoto and
Tomohiro Kobayashi and
Kazuko Inuzuka and
Naoaki Kanagawa and
Yasuyuki Kajitani and
Takeshi Ogawa and
J. Nakai and
Kiyoaki Iwasa and
Masatsugu Kojima and
Toshihiro Suzuki and
Yuya Suzuki and
Shintaro Sakai and
Tomofumi Fujimura and
Yuko Utsunomiya and
Toshifumi Hashimoto and
Makoto Miakashi and
Naoki Kobayashi and
M. Inagaki and
Yuuki Matsumoto and
Satoshi Inoue and
Yoshinao Suzuki and
D. He and
Yasuhiko Honda and
Junji Musha and
Masaki Nakagawa and
Mitsuaki Honma and
Naofumi Abiko and
Mitsumasa Koyanagi and
Masahiro Yoshihara and
Kazumi Ino and
Mitsuhiro Noguchi and
Teruhiko Kamei and
Yosuke Kato and
Shingo Zaitsu and
Hiroaki Nasu and
Takuya Ariki and
Hardwell Chibvongodze and
Mitsuyuki Watanabe and
Hong Ding and
Naoki Ookuma and
Ryuji Yamashita and
G. Liang and
Gertjan Hemink and
Farookh Moogat and
Cuong Trinh and
Masaaki Higashitani and
Tuan Pham and
Kousuke Kanazawa},
title = {A 19nm 112.8mm\({}^{\mbox{2}}\) 64Gb multi-level flash memory with
400Mb/s/pin 1.8V Toggle Mode interface},
booktitle = {2012 {IEEE} International Solid-State Circuits Conference, {ISSCC}
2012, San Francisco, CA, USA, February 19-23, 2012},
pages = {422--424},
publisher = {{IEEE}},
year = {2012},
url = {https://doi.org/10.1109/ISSCC.2012.6177073},
doi = {10.1109/ISSCC.2012.6177073},
timestamp = {Wed, 10 Mar 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/isscc/ShibataKH12.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@proceedings{DBLP:conf/3dic/2011,
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
publisher = {{IEEE}},
year = {2012},
url = {https://ieeexplore.ieee.org/xpl/conhome/6253019/proceeding},
isbn = {978-1-4673-2189-1},
timestamp = {Wed, 16 Oct 2019 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/2011.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/micromachines/FukushimaKIKKMBLTK11,
author = {Takafumi Fukushima and
Takayuki Konno and
Eiji Iwata and
Risato Kobayashi and
Toshiya Kojima and
Mariappan Murugesan and
Ji Chel Bea and
Kang Wook Lee and
Tetsu Tanaka and
Mitsumasa Koyanagi},
title = {Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision
Alignment and Direct Bonding without Thermal Compression for Hetero
Integration},
journal = {Micromachines},
volume = {2},
number = {1},
pages = {49--68},
year = {2011},
url = {https://doi.org/10.3390/mi2010049},
doi = {10.3390/MI2010049},
timestamp = {Tue, 16 Feb 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/micromachines/FukushimaKIKKMBLTK11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/FukushimaOBMLTK11,
author = {Takafumi Fukushima and
Yuki Ohara and
Jichoel Bea and
Mariappan Murugesan and
Kang Wook Lee and
Tetsu Tanaka and
Mitsumasa Koyanagi},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Temporary bonding strength control for self-assembly-based 3D integration},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262954},
doi = {10.1109/3DIC.2012.6262954},
timestamp = {Tue, 16 Feb 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/FukushimaOBMLTK11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/HozawaFHATSLFK11,
author = {Kazuyuki Hozawa and
Futoshi Furuta and
Yuko Hanaoka and
Mayu Aoki and
Kenichi Takeda and
Katsuyuki Sakuma and
Kang Wook Lee and
Takafumi Fukushima and
Mitsumasa Koyanagi},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Chip-level {TSV} integration for rapid prototyping of 3D system LSIs},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262952},
doi = {10.1109/3DIC.2012.6262952},
timestamp = {Tue, 16 Feb 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/HozawaFHATSLFK11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/ItoTACFK11,
author = {Yuka Ito and
Shinsuke Terada and
Shinya Arai and
Koji Choki and
Takafumi Fukushima and
Mitsumasa Koyanagi},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {High-bandwidth data transmission of new transceiver module through
optical interconnection},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263010},
doi = {10.1109/3DIC.2012.6263010},
timestamp = {Fri, 27 Dec 2019 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/ItoTACFK11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/KiyoyamaLFNKTK11,
author = {Kouji Kiyoyama and
Kang Wook Lee and
Takafumi Fukushima and
H. Naganuma and
H. Kobayashi and
Tetsu Tanaka and
Mitsumasa Koyanagi},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {A very low area {ADC} for 3-D stacked {CMOS} image processing system},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262958},
doi = {10.1109/3DIC.2012.6262958},
timestamp = {Tue, 16 Feb 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/KiyoyamaLFNKTK11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/LeeBFOTK11,
author = {Kang Wook Lee and
Jichoel Bea and
Takafumi Fukushima and
Yuki Ohara and
Tetsu Tanaka and
Mitsumasa Koyanagi},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {High reliable and fine size of 5-{\(\mu\)}m diameter backside Cu through-silicon
Via(TSV) for high reliability and high-end 3-D LSIs},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262975},
doi = {10.1109/3DIC.2012.6262975},
timestamp = {Tue, 16 Feb 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/LeeBFOTK11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/MotoyoshiTFAK11,
author = {Makoto Motoyoshi and
Junichi Takanohashi and
Takafumi Fukushima and
Yasuo Arai and
Mitsumasa Koyanagi},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Stacked {SOI} pixel detector using versatile fine pitch {\(\mu\)}-bump
technology},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262959},
doi = {10.1109/3DIC.2012.6262959},
timestamp = {Fri, 27 Dec 2019 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/MotoyoshiTFAK11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/MurugesanHKFTK11,
author = {Mariappan Murugesan and
Hideto Hashiguchi and
Harufumi Kobayashi and
Takafumi Fukushima and
Tetsu Tanaka and
Mitsumasa Koyanagi},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {W/Cu TSVs for 3D-LSI with minimum thermo-mechanical stress},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262970},
doi = {10.1109/3DIC.2012.6262970},
timestamp = {Fri, 27 Dec 2019 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/MurugesanHKFTK11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/MurugesanKFTK11,
author = {Mariappan Murugesan and
Harufumi Kobayashi and
Takafumi Fukushima and
Tetsu Tanaka and
Mitsumasa Koyanagi},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {High density Cu-TSVs and reliability issues},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262969},
doi = {10.1109/3DIC.2012.6262969},
timestamp = {Fri, 27 Dec 2019 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/MurugesanKFTK11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/NorikiLBFFK11,
author = {Akihiro Noriki and
Kang Wook Lee and
Jichoel Bea and
Takafumi Fukushima and
Tetsu Tanaka and
Mitsumasa Koyanagi},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Fabrication tolerance evaluation of high efficient unidirectional
optical coupler for though silicon photonic via in optoelectronic
3D-LSI},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262957},
doi = {10.1109/3DIC.2012.6262957},
timestamp = {Tue, 16 Feb 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/NorikiLBFFK11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/OharaLFTK11,
author = {Yuki Ohara and
Kang Wook Lee and
Takafumi Fukushima and
Tetsu Tanaka and
Mitsumasa Koyanagi},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Novel detachable bonding process with wettability control of bonding
surface for versatile chip-level 3D integration},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262950},
doi = {10.1109/3DIC.2012.6262950},
timestamp = {Tue, 16 Feb 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/OharaLFTK11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/islped/Koyanagi11,
author = {Mitsumasa Koyanagi},
editor = {Naehyuck Chang and
Hiroshi Nakamura and
Koji Inoue and
Kenichi Osada and
Massimo Poncino},
title = {3D super chip technology to achieve low-power and high-performance
system-on-a chip},
booktitle = {Proceedings of the 2011 International Symposium on Low Power Electronics
and Design, 2011, Fukuoka, Japan, August 1-3, 2011},
pages = {61--62},
publisher = {{IEEE/ACM}},
year = {2011},
url = {http://portal.acm.org/citation.cfm?id=2016819\&\#38;CFID=34981777\&\#38;CFTOKEN=25607807},
timestamp = {Mon, 13 Aug 2012 09:40:34 +0200},
biburl = {https://dblp.org/rec/conf/islped/Koyanagi11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/FukushimaIBMLTK10,
author = {Takafumi Fukushima and
Eiji Iwata and
Jichoel Bea and
Mariappan Murugesan and
Kang Wook Lee and
Tetsu Tanaka and
Mitsumasa Koyanagi},
title = {Evaluation of alignment accuracy on chip-to-wafer self-assembly and
mechanism on the direct chip bonding at room temperature},
booktitle = {{IEEE} International Conference on 3D System Integration, 3DIC 2010,
Munich, Germany, 16-18 November 2010},
pages = {1--5},
publisher = {{IEEE}},
year = {2010},
url = {https://doi.org/10.1109/3DIC.2010.5751436},
doi = {10.1109/3DIC.2010.5751436},
timestamp = {Tue, 16 Feb 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/FukushimaIBMLTK10.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/KiyoyamaLFNKTK10,
author = {Kouji Kiyoyama and
Kang Wook Lee and
Takafumi Fukushima and
H. Naganuma and
Hiroaki Kobayashi and
Tetsu Tanaka and
Mitsumasa Koyanagi},
title = {A block-parallel signal processing system for {CMOS} image sensor
with three-dimensional structure},
booktitle = {{IEEE} International Conference on 3D System Integration, 3DIC 2010,
Munich, Germany, 16-18 November 2010},
pages = {1--4},
publisher = {{IEEE}},
year = {2010},
url = {https://doi.org/10.1109/3DIC.2010.5751479},
doi = {10.1109/3DIC.2010.5751479},
timestamp = {Tue, 16 Feb 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/KiyoyamaLFNKTK10.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/MurugesanOBLFTK10,
author = {Mariappan Murugesan and
Yuki Ohara and
Jichoel Bea and
Kang Wook Lee and
Takafumi Fukushima and
Tetsu Tanaka and
Mitsumasa Koyanagi},
title = {Impact of microbump induced stress in thinned 3D-LSIs after wafer
bonding},
booktitle = {{IEEE} International Conference on 3D System Integration, 3DIC 2010,
Munich, Germany, 16-18 November 2010},
pages = {1--5},
publisher = {{IEEE}},
year = {2010},
url = {https://doi.org/10.1109/3DIC.2010.5751432},
doi = {10.1109/3DIC.2010.5751432},
timestamp = {Tue, 16 Feb 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/MurugesanOBLFTK10.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/NorikiLBFTK10,
author = {Akihiro Noriki and
Kang Wook Lee and
Jichoel Bea and
Takafumi Fukushima and
Tetsu Tanaka and
Mitsumasa Koyanagi},
title = {Through Silicon photonic via {(TSPV)} with Si core for low loss and
high-speed data transmission in opto-electronic 3-D {LSI}},
booktitle = {{IEEE} International Conference on 3D System Integration, 3DIC 2010,
Munich, Germany, 16-18 November 2010},
pages = {1--4},
publisher = {{IEEE}},
year = {2010},
url = {https://doi.org/10.1109/3DIC.2010.5751435},
doi = {10.1109/3DIC.2010.5751435},
timestamp = {Tue, 16 Feb 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/NorikiLBFTK10.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/cicc/KoyanagiFT10,
author = {Mitsumasa Koyanagi and
Takafumi Fukushima and
Tetsu Tanaka},
editor = {Jacqueline Snyder and
Rakesh Patel and
Tom Andre},
title = {Three-dimensional integration technology using through-si via based
on reconfigured wafer-to-wafer bonding},
booktitle = {{IEEE} Custom Integrated Circuits Conference, {CICC} 2010, San Jose,
California, USA, 19-22 September, 2010, Proceedings},
pages = {1--4},
publisher = {{IEEE}},
year = {2010},
url = {https://doi.org/10.1109/CICC.2010.5617626},
doi = {10.1109/CICC.2010.5617626},
timestamp = {Fri, 27 Dec 2019 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/cicc/KoyanagiFT10.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/pieee/KoyanagiFT09,
author = {Mitsumasa Koyanagi and
Takafumi Fukushima and
Tetsu Tanaka},
title = {High-Density Through Silicon Vias for 3-D LSIs},
journal = {Proc. {IEEE}},
volume = {97},
number = {1},
pages = {49--59},
year = {2009},
url = {https://doi.org/10.1109/JPROC.2008.2007463},
doi = {10.1109/JPROC.2008.2007463},
timestamp = {Fri, 02 Oct 2020 01:00:00 +0200},
biburl = {https://dblp.org/rec/journals/pieee/KoyanagiFT09.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/BeaMONKLFTK09,
author = {Ji Chel Bea and
Mariappan Murugesan and
Yuki Ohara and
Akihiro Noriki and
Hisashi Kino and
Kang Wook Lee and
Takafumi Fukushima and
Tetsu Tanaka and
Mitsumasa Koyanagi},
title = {Micro-Raman spectroscopy analysis and capacitance - time (C-t) measurement
of thinned silicon substrates for 3D integration},
booktitle = {{IEEE} International Conference on 3D System Integration, 3DIC 2009,
San Francisco, California, USA, 28-30 September 2009},
pages = {1--5},
publisher = {{IEEE}},
year = {2009},
url = {https://doi.org/10.1109/3DIC.2009.5306568},
doi = {10.1109/3DIC.2009.5306568},
timestamp = {Sat, 30 Sep 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/BeaMONKLFTK09.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/FukushimaITK09,
author = {Takafumi Fukushima and
Eiji Iwata and
Tetsu Tanaka and
Mitsumasa Koyanagi},
title = {Development of a new self-assembled die bonder to three-dimensionally
stack known good dies in batch},
booktitle = {{IEEE} International Conference on 3D System Integration, 3DIC 2009,
San Francisco, California, USA, 28-30 September 2009},
pages = {1--4},
publisher = {{IEEE}},
year = {2009},
url = {https://doi.org/10.1109/3DIC.2009.5306524},
doi = {10.1109/3DIC.2009.5306524},
timestamp = {Fri, 27 Dec 2019 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/FukushimaITK09.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/KaihoOTKLTK09,
author = {Yoshiyuki Kaiho and
Yuki Ohara and
Hirotaka Takeshita and
Kouji Kiyoyama and
Kang Wook Lee and
Tetsu Tanaka and
Mitsumasa Koyanagi},
title = {3D integration technology for 3D stacked retinal chip},
booktitle = {{IEEE} International Conference on 3D System Integration, 3DIC 2009,
San Francisco, California, USA, 28-30 September 2009},
pages = {1--4},
publisher = {{IEEE}},
year = {2009},
url = {https://doi.org/10.1109/3DIC.2009.5306564},
doi = {10.1109/3DIC.2009.5306564},
timestamp = {Wed, 17 Feb 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/KaihoOTKLTK09.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/KiyoyamaOLYFTK09,
author = {Kouji Kiyoyama and
Yuki Ohara and
Kang Wook Lee and
Y. Yang and
Takafumi Fukushima and
Tetsu Tanaka and
Mitsumasa Koyanagi},
title = {A parallel {ADC} for high-speed {CMOS} image processing system with
3D structure},
booktitle = {{IEEE} International Conference on 3D System Integration, 3DIC 2009,
San Francisco, California, USA, 28-30 September 2009},
pages = {1--4},
publisher = {{IEEE}},
year = {2009},
url = {https://doi.org/10.1109/3DIC.2009.5306583},
doi = {10.1109/3DIC.2009.5306583},
timestamp = {Tue, 16 Feb 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/KiyoyamaOLYFTK09.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/LeeKOKBFTK09,
author = {Kang Wook Lee and
Shigeyuki Kanno and
Yuki Ohara and
Kouji Kiyoyama and
Ji Chel Bea and
Takafumi Fukushima and
Tetsu Tanaka and
Mitsumasa Koyanagi},
title = {Heterogeneous integration technology for {MEMS-LSI} multi-chip module},
booktitle = {{IEEE} International Conference on 3D System Integration, 3DIC 2009,
San Francisco, California, USA, 28-30 September 2009},
pages = {1--6},
publisher = {{IEEE}},
year = {2009},
url = {https://doi.org/10.1109/3DIC.2009.5306599},
doi = {10.1109/3DIC.2009.5306599},
timestamp = {Tue, 16 Feb 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/LeeKOKBFTK09.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/OharaNSLMBYFTK09,
author = {Yuki Ohara and
Akihiro Noriki and
Katsuyuki Sakuma and
Kang Wook Lee and
Mariappan Murugesan and
Jichoel Bea and
Fumiaki Yamada and
Takafumi Fukushima and
Tetsu Tanaka and
Mitsumasa Koyanagi},
title = {10 {\(\mathrm{\mu}\)}m fine pitch Cu/Sn micro-bumps for 3-D super-chip
stack},
booktitle = {{IEEE} International Conference on 3D System Integration, 3DIC 2009,
San Francisco, California, USA, 28-30 September 2009},
pages = {1--6},
publisher = {{IEEE}},
year = {2009},
url = {https://doi.org/10.1109/3DIC.2009.5306532},
doi = {10.1109/3DIC.2009.5306532},
timestamp = {Tue, 16 Feb 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/OharaNSLMBYFTK09.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/aspdac/KoyanagiFT09,
author = {Mitsumasa Koyanagi and
Takafumi Fukushima and
Tetsu Tanaka},
editor = {Kazutoshi Wakabayashi},
title = {Three-dimensional integration technology and integrated systems},
booktitle = {Proceedings of the 14th Asia South Pacific Design Automation Conference,
{ASP-DAC} 2009, Yokohama, Japan, January 19-22, 2009},
pages = {409--415},
publisher = {{IEEE}},
year = {2009},
url = {https://doi.org/10.1109/ASPDAC.2009.4796515},
doi = {10.1109/ASPDAC.2009.4796515},
timestamp = {Fri, 27 Dec 2019 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/aspdac/KoyanagiFT09.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/iros/KonnoUITSDKU06,
author = {Atsushi Konno and
Ryo Uchikura and
Toshiyuki Ishihara and
Teppei Tsujita and
Takeaki Sugimura and
Jun Deguchi and
Mitsumasa Koyanagi and
Masaru Uchiyama},
title = {Development of a High Speed Vision System for Mobile Robots},
booktitle = {2006 {IEEE/RSJ} International Conference on Intelligent Robots and
Systems, {IROS} 2006, October 9-15, 2006, Beijing, China},
pages = {1372--1377},
publisher = {{IEEE}},
year = {2006},
url = {https://doi.org/10.1109/IROS.2006.281925},
doi = {10.1109/IROS.2006.281925},
timestamp = {Wed, 16 Oct 2019 14:14:51 +0200},
biburl = {https://dblp.org/rec/conf/iros/KonnoUITSDKU06.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/arcs/SugimuraKNFKK05,
author = {Takeaki Sugimura and
Yuta Konishi and
Yoshihiro Nakatani and
Takafumi Fukushima and
Hiroyuki Kurino and
Mitsumasa Koyanagi},
editor = {Uwe Brinkschulte and
J{\"{u}}rgen Becker and
Dietmar Fey and
Christian Hochberger and
Thomas Martinetz and
Christian M{\"{u}}ller{-}Schloer and
Hartmut Schmeck and
Theo Ungerer and
Rolf P. W{\"{u}}rtz},
title = {Dynamic Multi-Context Reconfiguration Scheme for Reconfigurable Parallel
Image Processing System with Three Dimensional Structure},
booktitle = {18th International Conference on Architecture of Computing Systems,
Workshops, Innsbruck, Austria, March 2005},
pages = {27--32},
publisher = {{VDE} Verlag},
year = {2005},
timestamp = {Fri, 19 Jul 2019 13:02:47 +0200},
biburl = {https://dblp.org/rec/conf/arcs/SugimuraKNFKK05.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/aina/LiuSKK04,
author = {Zhe Liu and
JeoungChill Shim and
Hiroyuki Kurino and
Mitsumasa Koyanagi},
title = {Design of {A} Novel Real-Shared Memory Module for High Performance
Parallel Processor System with Shared Memory},
booktitle = {18th International Conference on Advanced Information Networking and
Applications {(AINA} 2004), 29-31 March 2004, Fukuoka, Japan},
pages = {241--244},
publisher = {{IEEE} Computer Society},
year = {2004},
url = {https://doi.org/10.1109/AINA.2004.1283795},
doi = {10.1109/AINA.2004.1283795},
timestamp = {Fri, 24 Mar 2023 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/aina/LiuSKK04.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/pdcat/LiuSKK04,
author = {Zhe Liu and
JeoungChill Shim and
Hiroyuki Kurino and
Mitsumasa Koyanagi},
editor = {Kim{-}Meow Liew and
Hong Shen and
Simon See and
Wentong Cai and
Pingzhi Fan and
Susumu Horiguchi},
title = {Design and Evaluation of a Novel Real-Shared Cache Module for High
Performance Parallel Processor Chip},
booktitle = {Parallel and Distributed Computing: Applications and Technologies,
5th International Conference, {PDCAT} 2004, Singapore, December 8-10,
2004, Proceedings},
series = {Lecture Notes in Computer Science},
volume = {3320},
pages = {564--569},
publisher = {Springer},
year = {2004},
url = {https://doi.org/10.1007/978-3-540-30501-9\_108},
doi = {10.1007/978-3-540-30501-9\_108},
timestamp = {Fri, 12 Jun 2020 16:01:21 +0200},
biburl = {https://dblp.org/rec/conf/pdcat/LiuSKK04.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/fpt/SugimuraSKK03,
author = {Takeaki Sugimura and
JeoungChill Shim and
Hiroyuki Kurino and
Mitsumasa Koyanagi},
title = {Parallel image processing field programmable gate array for real time
image processing system},
booktitle = {Proceedings of the 2003 {IEEE} International Conference on Field-Programmable
Technology, Tokyo, Japan, {FPT} 2003, December 15-17, 2003},
pages = {372--374},
publisher = {{IEEE}},
year = {2003},
url = {https://doi.org/10.1109/FPT.2003.1275779},
doi = {10.1109/FPT.2003.1275779},
timestamp = {Wed, 16 Oct 2019 14:14:52 +0200},
biburl = {https://dblp.org/rec/conf/fpt/SugimuraSKK03.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/dac/BrodersenHKKLK02,
author = {Robert W. Brodersen and
Anthony M. Hill and
John Kibarian and
Desmond Kirkpatrick and
Mark A. Lavin and
Mitsumasa Koyanagi},
title = {Nanometer design: what hurts next...?},
booktitle = {Proceedings of the 39th Design Automation Conference, {DAC} 2002,
New Orleans, LA, USA, June 10-14, 2002},
pages = {242},
publisher = {{ACM}},
year = {2002},
url = {https://doi.org/10.1145/513918.513981},
doi = {10.1145/513918.513981},
timestamp = {Tue, 06 Nov 2018 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/dac/BrodersenHKKLK02.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/nips/KurinoNLNYPK00,
author = {Hiroyuki Kurino and
Masaki Nakagawa and
Kang Wook Lee and
Tomonori Nakamura and
Yuusuke Yamada and
Ki Tae Park and
Mitsumasa Koyanagi},
editor = {Todd K. Leen and
Thomas G. Dietterich and
Volker Tresp},
title = {Smart Vision Chip Fabricated Using Three Dimensional Integration Technology},
booktitle = {Advances in Neural Information Processing Systems 13, Papers from
Neural Information Processing Systems {(NIPS)} 2000, Denver, CO, {USA}},
pages = {720--726},
publisher = {{MIT} Press},
year = {2000},
url = {https://proceedings.neurips.cc/paper/2000/hash/ff7d0f525b3be596a51fb919492c099c-Abstract.html},
timestamp = {Mon, 16 May 2022 15:41:51 +0200},
biburl = {https://dblp.org/rec/conf/nips/KurinoNLNYPK00.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/micro/KoyanagiKLSMI98,
author = {Mitsumasa Koyanagi and
Hiroyuki Kurino and
Kang Wook Lee and
Katsuyuki Sakuma and
Nobuaki Miyakawa and
Hikotaro Itani},
title = {Future system-on-silicon {LSI} chips},
journal = {{IEEE} Micro},
volume = {18},
number = {4},
pages = {17--22},
year = {1998},
url = {https://doi.org/10.1109/40.710867},
doi = {10.1109/40.710867},
timestamp = {Wed, 17 Feb 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/micro/KoyanagiKLSMI98.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/aspdac/HiranoOKK98,
author = {Keiichi Hirano and
Taizou Ono and
Hiroyuki Kurino and
Mitsumasa Koyanagi},
title = {A New Multiport Memory for High Performance Parallel Processor System
with Shared Memory},
booktitle = {Proceedings of the {ASP-DAC} '98, Asia and South Pacific Design Automation
Conference 1998, Pacifico Yokohama, Yokohama, Japan, February 10-13,
1998},
pages = {333--334},
publisher = {{IEEE}},
year = {1998},
url = {https://doi.org/10.1109/ASPDAC.1998.669491},
doi = {10.1109/ASPDAC.1998.669491},
timestamp = {Fri, 04 Dec 2020 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/aspdac/HiranoOKK98.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/vlsi/Koyanagi91,
author = {Mitsumasa Koyanagi},
editor = {Arne Halaas and
Peter B. Denyer},
title = {A New Chip Architecture for VLSIs - Optical Coupled 3D Common Memory
and Optical Interconnections},
booktitle = {{VLSI} 91, Proceedings of the {IFIP} {TC10/WG} 10.5 International
Conference on Very Large Scale Integration, Edinburgh, Scotland, 20-22
August, 1991},
series = {{IFIP} Transactions},
volume = {{A-1}},
pages = {377--386},
publisher = {North-Holland},
year = {1991},
timestamp = {Fri, 02 Aug 2019 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/vlsi/Koyanagi91.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
a service of 
manage site settings
To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.
last updated on 2023-10-01 22:27 CEST by the dblp team
all metadata released as open data under CC0 1.0 license
see also: Terms of Use | Privacy Policy | Imprint
dblp was originally created in 1993 at:
since 2018, dblp has been operated and maintained by:
the dblp computer science bibliography is funded and supported by:
