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Xingsheng Liu

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2000 – 2009

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2005
[j4]
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  - journals/mr/LinCLL05
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Y. C. Lin, X. Chen, Xingsheng Liu, Guo-Quan Lu:
Effect of substrate flexibility on solder joint reliability. Part II: finite element modeling. Microelectronics Reliability 45(1): 143-154 (2005)
2002
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Xingsheng Liu, Shuangyan Xu, Guo-Quan Lu, David A. Dillard:
Effect of substrate flexibility on solder joint reliability. Microelectronics Reliability 42(12): 1883-1891 (2002)
2001
[j2]
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  - journals/mr/HaqueSCWLBL01
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Shatil Haque, Kalyan Siddabattula, Mike Craven, Sihua Wen, Xingsheng Liu, Dushan Boroyevich, Guo-Quan Lu:
Design issues of a three-dimensional packaging scheme for power modules. Microelectronics Reliability 41(2): 295-305 (2001)
[j1]
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Xingsheng Liu, Shuangyan Xu, Guo-Quan Lu, David A. Dillard:
Stacked solder bumping technology for improved solder joint reliability. Microelectronics Reliability 41(12): 1979-1992 (2001)

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