John F. Bulzacchelli

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

◀ ▶ joint publications with Sang-Hune Park

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Publications

2023
[j21]
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Timothy O. Dickson, Zeynep Toprak Deniz, Martin Cochet, Troy J. Beukema, Marcel A. Kossel, Thomas Morf, Young-Ho Choi, Pier Andrea Francese, Matthias Brändli, Christian W. Baks, Jonathan E. Proesel, John F. Bulzacchelli, Michael P. Beakes, Byoung-Joo Yoo, Hyoungbae Ahn, Dong-Hyuk Lim, Gunil Kang, Sang-Hune Park, Mounir Meghelli, Hyo-Gyuem Rhew, Daniel J. Friedman, Michael Choi, Mehmet Soyuer, Jongshin Shin:
A 72-GS/s, 8-Bit DAC-Based Wireline Transmitter in 4-nm FinFET CMOS for 200+ Gb/s Serial Links. IEEE J. Solid State Circuits 58(4): 1074-1086 (2023)
2022
[c20]
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Timothy O. Dickson, Zeynep Toprak Deniz, Martin Cochet, Marcel A. Kossel, Thomas Morf, Young-Ho Choi, Pier Andrea Francese, Matthias Brändli, Troy J. Beukema, Christian W. Baks, Jonathan E. Proesel, John F. Bulzacchelli, Michael P. Beakes, Byoung-Joo Yoo, Hyoungbae Ahn, Dong-Hyuk Lim, Gunil Kang, Sang-Hune Park, Mounir Meghelli, Hyo-Gyuem Rhew, Daniel J. Friedman, Michael Choi, Mehmet Soyuer, Jongshin Shin:
A 72GS/s, 8-bit DAC-based Wireline Transmitter in 4nm FinFET CMOS for 200+Gb/s Serial Links. VLSI Technology and Circuits 2022: 28-29
[c19]
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  - conf/vlsit/YonarFBKMPRACDD22
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Serdar S. Yonar, Pier Andrea Francese, Matthias Brändli, Marcel A. Kossel, Thomas Morf, Jonathan E. Proesel, Sergey V. Rylov, Herschel A. Ainspan, Martin Cochet, Zeynep Toprak Deniz, Timothy O. Dickson, Troy J. Beukema, Christian W. Baks, Michael P. Beakes, John F. Bulzacchelli, Young-Ho Choi, Byoung-Joo Yoo, Hyoungbae Ahn, Dong-Hyuk Lim, Gunil Kang, Sang-Hune Park, Mounir Meghelli, Hyo-Gyuem Rhew, Daniel J. Friedman, Michael Choi, Mehmet Soyuer, Jongshin Shin:
An 8-bit 56GS/s 64x Time-Interleaved ADC with Bootstrapped Sampler and Class-AB Buffer in 4nm CMOS. VLSI Technology and Circuits 2022: 168-169

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