G. Q. Zhang

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

◀ ▶ joint publications with Yang Liu 0103

> Home > Persons > G. Q. Zhang

Publications

2018
[j73]
- view
  authority control:
- export record
  dblp key:
  - journals/mr/ZhangLWFFSZ18
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/ZhangLWFFSZ18
Hao Zhang, Yang Liu, Lingen Wang, Jiajie Fan, Xuejun Fan, Fenglian Sun, Guoqi Zhang:
A new hermetic sealing method for ceramic package using nanosilver sintering technology. Microelectron. Reliab. 81: 143-149 (2018)
2015
[j54]
- view
  authority control:
- export record
  dblp key:
  - journals/mr/LiuSZXYZ15
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/LiuSZXYZ15
Yang Liu, Fenglian Sun, Hao Zhang, Tong Xin, Cadmus A. Yuan, Guoqi Zhang:
Interfacial reaction and failure mode analysis of the solder joints for flip-chip LED on ENIG and Cu-OSP surface finishes. Microelectron. Reliab. 55(8): 1234-1240 (2015)
2014
[j46]
- view
  authority control:
- export record
  dblp key:
  - journals/mr/LiuLZWYZSL14
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/LiuLZWYZSL14
Yang Liu, Stanley Y. Y. Leung, Jia Zhao, Cell K. Y. Wong, Cadmus A. Yuan, Guoqi Zhang, Fenglian Sun, Liangliang Luo:
Thermal and mechanical effects of voids within flip chip soldering in LED packages. Microelectron. Reliab. 54(9-10): 2028-2033 (2014)

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.