BibTeX records: A. Radisic

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@article{DBLP:journals/mr/YangLLZROTVW10,
  author    = {Y. Yang and
               Riet Labie and
               F. Ling and
               C. Zhao and
               A. Radisic and
               Jan Van Olmen and
               Youssef Travaly and
               Bert Verlinden and
               Ingrid De Wolf},
  title     = {Processing assessment and adhesion evaluation of copper through-silicon
               vias (TSVs) for three-dimensional stacked-integrated circuit {(3D-SIC)}
               architectures},
  journal   = {Microelectron. Reliab.},
  volume    = {50},
  number    = {9-11},
  pages     = {1636--1640},
  year      = {2010},
  url       = {https://doi.org/10.1016/j.microrel.2010.07.019},
  doi       = {10.1016/j.microrel.2010.07.019},
  timestamp = {Sat, 22 Feb 2020 00:00:00 +0100},
  biburl    = {https://dblp.org/rec/journals/mr/YangLLZROTVW10.bib},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
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