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2020 – today
- 2022
[j3]Sae Kyu Lee
, Ankur Agrawal, Joel Silberman, Matthew M. Ziegler, Mingu Kang, Swagath Venkataramani, Nianzheng Cao, Bruce M. Fleischer, Michael Guillorn, Matthew Cohen, Silvia M. Mueller, Jinwook Oh, Martin Lutz, Jinwook Jung, Siyu Koswatta, Ching Zhou, Vidhi Zalani, Monodeep Kar, James Bonanno, Robert Casatuta, Chia-Yu Chen, Jungwook Choi, Howard Haynie, Alyssa Herbert, Radhika Jain, Kyu-Hyoun Kim, Yulong Li, Zhibin Ren, Scot Rider, Marcel Schaal, Kerstin Schelm, Michael Scheuermann, Xiao Sun, Hung Tran, Naigang Wang, Wei Wang, Xin Zhang, Vinay Shah, Brian W. Curran, Vijayalakshmi Srinivasan, Pong-Fei Lu, Sunil Shukla, Kailash Gopalakrishnan, Leland Chang:
A 7-nm Four-Core Mixed-Precision AI Chip With 26.2-TFLOPS Hybrid-FP8 Training, 104.9-TOPS INT4 Inference, and Workload-Aware Throttling. IEEE J. Solid State Circuits 57(1): 182-197 (2022)- 2021
- [c10]Swagath Venkataramani, Vijayalakshmi Srinivasan, Wei Wang, Sanchari Sen, Jintao Zhang, Ankur Agrawal, Monodeep Kar, Shubham Jain, Alberto Mannari, Hoang Tran, Yulong Li, Eri Ogawa, Kazuaki Ishizaki, Hiroshi Inoue, Marcel Schaal, Mauricio J. Serrano, Jungwook Choi, Xiao Sun, Naigang Wang, Chia-Yu Chen, Allison Allain, James Bonanno, Nianzheng Cao, Robert Casatuta, Matthew Cohen, Bruce M. Fleischer, Michael Guillorn, Howard Haynie, Jinwook Jung, Mingu Kang, Kyu-Hyoun Kim, Siyu Koswatta, Sae Kyu Lee, Martin Lutz, Silvia M. Mueller, Jinwook Oh, Ashish Ranjan, Zhibin Ren, Scot Rider, Kerstin Schelm, Michael Scheuermann, Joel Silberman, Jie Yang, Vidhi Zalani, Xin Zhang, Ching Zhou, Matthew M. Ziegler, Vinay Shah, Moriyoshi Ohara, Pong-Fei Lu, Brian W. Curran, Sunil Shukla, Leland Chang, Kailash Gopalakrishnan:
RaPiD: AI Accelerator for Ultra-low Precision Training and Inference. ISCA 2021: 153-166 - [c9]Ankur Agrawal, Sae Kyu Lee, Joel Silberman, Matthew M. Ziegler, Mingu Kang, Swagath Venkataramani, Nianzheng Cao, Bruce M. Fleischer, Michael Guillorn, Matt Cohen, Silvia M. Mueller, Jinwook Oh, Martin Lutz, Jinwook Jung, Siyu Koswatta, Ching Zhou, Vidhi Zalani, James Bonanno, Robert Casatuta, Chia-Yu Chen, Jungwook Choi, Howard Haynie, Alyssa Herbert, Radhika Jain, Monodeep Kar, Kyu-Hyoun Kim, Yulong Li, Zhibin Ren, Scot Rider, Marcel Schaal, Kerstin Schelm, Michael Scheuermann, Xiao Sun, Hung Tran, Naigang Wang, Wei Wang, Xin Zhang, Vinay Shah, Brian W. Curran, Vijayalakshmi Srinivasan, Pong-Fei Lu, Sunil Shukla, Leland Chang, Kailash Gopalakrishnan:
A 7nm 4-Core AI Chip with 25.6TFLOPS Hybrid FP8 Training, 102.4TOPS INT4 Inference and Workload-Aware Throttling. ISSCC 2021: 144-146 - 2020
- [j2]Swagath Venkataramani, Xiao Sun, Naigang Wang, Chia-Yu Chen, Jungwook Choi, Mingu Kang, Ankur Agarwal, Jinwook Oh, Shubham Jain, Tina Babinsky, Nianzheng Cao, Thomas W. Fox, Bruce M. Fleischer, George Gristede, Michael Guillorn, Howard Haynie, Hiroshi Inoue, Kazuaki Ishizaki, Michael J. Klaiber, Shih-Hsien Lo, Gary W. Maier, Silvia M. Mueller, Michael Scheuermann, Eri Ogawa, Marcel Schaal, Mauricio J. Serrano, Joel Silberman, Christos Vezyrtzis, Wei Wang, Fanchieh Yee, Jintao Zhang, Matthew M. Ziegler, Ching Zhou, Moriyoshi Ohara, Pong-Fei Lu, Brian W. Curran, Sunil Shukla, Vijayalakshmi Srinivasan, Leland Chang, Kailash Gopalakrishnan:
Efficient AI System Design With Cross-Layer Approximate Computing. Proc. IEEE 108(12): 2232-2250 (2020) - [c8]Jinwook Oh, Sae Kyu Lee, Mingu Kang, Matthew M. Ziegler, Joel Silberman, Ankur Agrawal, Swagath Venkataramani, Bruce M. Fleischer, Michael Guillorn, Jungwook Choi, Wei Wang, Silvia M. Mueller, Shimon Ben-Yehuda, James Bonanno, Nianzheng Cao, Robert Casatuta, Chia-Yu Chen, Matt Cohen, Ophir Erez, Thomas W. Fox, George Gristede, Howard Haynie, Vicktoria Ivanov, Siyu Koswatta, Shih-Hsien Lo, Martin Lutz, Gary W. Maier, Alex Mesh, Yevgeny Nustov, Scot Rider, Marcel Schaal, Michael Scheuermann, Xiao Sun, Naigang Wang, Fanchieh Yee, Ching Zhou, Vinay Shah, Brian W. Curran, Vijayalakshmi Srinivasan, Pong-Fei Lu, Sunil Shukla, Kailash Gopalakrishnan, Leland Chang:
A 3.0 TFLOPS 0.62V Scalable Processor Core for High Compute Utilization AI Training and Inference. VLSI Circuits 2020: 1-2
2010 – 2019
- 2018
- [j1]David Wolpert, Erwin Behnen, Leon J. Sigal, Yuen H. Chan, Gustavo Enrique Téllez, Douglas Bradley, Richard E. Serton, Rajesh Veerabhadraiah, William Ansley, Andrew Bianchi, Nagu Dhanwada, Sungjae Lee, Michael Scheuermann, Glen A. Wiedemeier, John Davis, Tobias Werner, Laura Darden, Keith G. Barkley, Michael Gray, Matthew Guzowski, Mitch DeHond, Timothy Schell, Stelios Tsapepas, Di Phan, Kriti Acharya, Jeffrey A. Zitz, Hunter F. Shi, Christopher J. Berry, James D. Warnock, Michael H. Wood, Robert M. Averill III:
IBM z14: Enabling physical design in 14-nm technology for high-performance, high-reliability microprocessors. IBM J. Res. Dev. 62(2/3): 10:1-10:14 (2018) - [c7]Vijayalakshmi Srinivasan, Bruce M. Fleischer, Sunil Shukla, Matthew M. Ziegler, Joel Silberman, Jinwook Oh, Jungwook Choi, Silvia M. Mueller, Ankur Agrawal, Tina Babinsky, Nianzheng Cao, Chia-Yu Chen, Pierce Chuang, Thomas W. Fox, George Gristede, Michael Guillorn, Howard Haynie, Michael J. Klaiber, Dongsoo Lee, Shih-Hsien Lo, Gary W. Maier, Michael Scheuermann, Swagath Venkataramani, Christos Vezyrtzis, Naigang Wang, Fanchieh Yee, Ching Zhou, Pong-Fei Lu, Brian W. Curran, Leland Chang, Kailash Gopalakrishnan:
Across the Stack Opportunities for Deep Learning Acceleration. ISLPED 2018: 35:1-35:2 - [c6]Bruce M. Fleischer, Sunil Shukla, Matthew M. Ziegler, Joel Silberman, Jinwook Oh, Vijayalakshmi Srinivasan, Jungwook Choi, Silvia M. Mueller, Ankur Agrawal, Tina Babinsky, Nianzheng Cao, Chia-Yu Chen, Pierce Chuang, Thomas W. Fox, George Gristede, Michael Guillorn, Howard Haynie, Michael J. Klaiber, Dongsoo Lee, Shih-Hsien Lo, Gary W. Maier, Michael Scheuermann, Swagath Venkataramani, Christos Vezyrtzis, Naigang Wang, Fanchieh Yee, Ching Zhou, Pong-Fei Lu, Brian W. Curran, Leland Chang, Kailash Gopalakrishnan:
A Scalable Multi- TeraOPS Deep Learning Processor Core for AI Trainina and Inference. VLSI Circuits 2018: 35-36 - 2016
- [c5]Michael Scheuermann, Shurong Tian, Raphael Robertazzi, Matthew R. Wordeman, C. Bergeron, H. Jacobson, Phillip J. Restle, Joel Silberman, Christy Tyberg:
Thermal analysis of multi-layer functional 3D logic stacks. 3DIC 2016: 1-4 - 2013
- [c4]Xin Zhao, Yang Wan, Michael Scheuermann, Sung Kyu Lim:
Transient modeling of TSV-wire electromigration and lifetime analysis of power distribution network for 3D ICs. ICCAD 2013: 363-370 - 2012
- [c3]Xin Zhao, Michael Scheuermann, Sung Kyu Lim:
Analysis of DC current crowding in through-silicon-vias and its impact on power integrity in 3D ICs. DAC 2012: 157-162 - [c2]Matt Wordeman, Joel Silberman, Gary W. Maier, Michael Scheuermann:
A 3D system prototype of an eDRAM cache stacked over processor-like logic using through-silicon vias. ISSCC 2012: 186-187 - 2011
- [c1]Jeff Burns, Gary Carpenter, Eren Kursun, Ruchir Puri, James D. Warnock, Michael Scheuermann:
Design, CAD and technology challenges for future processors: 3D perspectives. DAC 2011: 212
Coauthor Index
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