Effects of lead widths and pitches on reliability of soldered joints and optimum simulation for QFP devices.

Sun, 01 Jan 2006 00:00:00 +0100

Songbai Xue, Yuxiu Wu, Zongjie Han, Ling Zhang:
Effects of lead widths and pitches on reliability of soldered joints and optimum simulation for QFP devices. CGVR 2006: 168-174