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Myong-Suk Kang

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2010 – 2019

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2011
[c2]
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Won-Myoung Ki, Myong-Suk Kang, Sehoon Yoo, Chang-Woo Lee:
Fabrication and bonding process of fine pitch Cu pillar bump on thin Si chip for 3D stacking IC. 3DIC 2011: 1-4
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Young-Ki Ko, Myong-Suk Kang, Hiroyuki Kokawa, Yutaka S. Sato, Sehoon Yoo, Chang-Woo Lee:
Advanced TSV filling method with Sn alloy and its reliability. 3DIC 2011: 1-4

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