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Sung-Geun Kang

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Conference and Workshop Papers

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2011
[c1]
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Sung-Geun Kang, Youngrae Kim, Eun-Sol Kim, Naeun Lim, Teakgyu Jeong, Jieun Lee, Sarah Eunkyung Kim, Sungdong Kim:
Evaluation of wafer level Cu bonding for 3D integration. 3DIC 2011: 1-2

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