BibTeX records: Ming-Cheng Lu

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@article{DBLP:journals/mr/KungCL13,
  author    = {Huang{-}Kuang Kung and
               Hung{-}Shyong Chen and
               Ming{-}Cheng Lu},
  title     = {The wire sag problem in wire bonding technology for semiconductor
               packaging},
  journal   = {Microelectron. Reliab.},
  volume    = {53},
  number    = {2},
  pages     = {288--296},
  year      = {2013}
}
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