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HengSheng Shan
This is just a disambiguation page, and is not intended to be the bibliography of an actual person. Any publication listed on this page has not been assigned to an actual author yet. If you know the true author of one of the publications listed below, you are welcome to contact us.
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2020 – today
- 2024
- [j7]Ning Wang, Jian-Zhao Liu, Zhi-Jie Shi, Heng-Sheng Shan, Hongzhi Jia, Hui Yang, Lei Zuo:
Self-Powered Intelligent Cooling System for High-Power Light-Emitting Diodes Based on Temperature Feedback Mechanism. IEEE Trans. Ind. Electron. 71(9): 10795-10805 (2024) - 2023
- [j6]Ning Wang, Ao Wang, Chen Zhang, Heng-Sheng Shan, Hongzhi Jia, Ji-Hong Zheng, You-Rong Liu, Lei Zuo:
Self-Adaptive PDLC Control Strategy With Smart Light Intensity Adjustment Using Photovoltaic-Thermoelectric Hybrid Energy Supply Technology. IEEE Trans. Ind. Electron. 70(10): 10146-10155 (2023) - [j5]Xiaoya Li, Wei Zhou, Jinye Peng, HengSheng Shan:
Joint beamwidth and resource optimization in ultra-dense MmWave D2D communications. Wirel. Networks 29(5): 2093-2104 (2023)
2010 – 2019
- 2019
- [j4]Heng-Sheng Shan, Xiao-Ya Li, Bin Chen, Shu-Fang Ma, Lu Li, Bing-She Xu:
Effect of Indium Composition on the Microstructural Properties and Performance of InGaN/GaN MQWs Solar Cells. IEEE Access 7: 182573-182579 (2019) - 2018
- [j3]Xiao-Ya Li, Chen He, Heng-Sheng Shan, Jiandong Li, Z. Jane Wang:
Feasibility-Aware Partial Interference Alignment for Hybrid D2D and Cellular Communication Networks. IEEE Access 6: 71069-71083 (2018) - 2016
- [j2]Xiao-Ya Li, Jiandong Li, Wei Liu, Yan Zhang, HengSheng Shan:
Group-Sparse-Based Joint Power and Resource Block Allocation Design of Hybrid Device-to-Device and LTE-Advanced Networks. IEEE J. Sel. Areas Commun. 34(1): 41-57 (2016) - 2013
- [j1]Yintang Yang, Ning Wang, Gang Dong, Yi Liu, Bin Chen, JunShuai Xue, HengSheng Shan, Yan Zhang:
Two-dimensional electrical modeling of thermoelectric devices considering temperature-dependent parameters under the condition of nonuniform substrate temperature distribution. Microelectron. J. 44(3): 270-276 (2013)
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