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Tae Ho Ha

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2010 – 2019

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2013
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Jae Hak Lee, Hyoung Joon Kim, Jun-Yeob Song, Chang Woo Lee, Tae Ho Ha:
A study on wafer level TSV build-up integration method. 3DIC 2013: 1-4
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Jun-Yeob Song, Jae Hak Lee, Hyoung Joon Kim, Chang Woo Lee, Tae Ho Ha:
High reliability insert-bump bonding process for 3D integration. 3DIC 2013: 1-4

2000 – 2009

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2004
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Tae Ho Ha, Keiichi Kimura, Takashi Miyoshi, Yasuhiro Takaya:
Automatic 3D-Laser Scattering Measurement for Ultra-Finished Surface with Nanowatt Sensitivity. J. Robotics Mechatronics 16(1): 97-103 (2004)

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