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Kuo-Chio Liu

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2010 – 2019

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2014
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  - https://dblp.org/rec/journals/mr/ChengFLLWLC14
Hsi-Kuei Cheng, Shien-Ping Feng, Yi-Jen Lai, Kuo-Chio Liu, Ying-Lang Wang, Tzeng-Feng Liu, Chih-Ming Chen:
Effect of polyimide baking on bump resistance in flip-chip solder joints. Microelectron. Reliab. 54(3): 629-632 (2014)

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