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2020 – today
- 2024
[c10]Valeriy Sukharev, Jun-Ho Choy, Armen Kteyan, J. Shuster-Passage, Seungman Choi, Martin Gall:
A Unified Physics-Based Stochastic Model for EM-Induced Resistance Degradation in BEoL Interconnect Segments. IRPS 2024: 1-10- [c9]J. Shuster-Passage, S. Abdel Razek, M. Mattoo, Meike Hauschildt, Seungman Choi, Martin Gall, Armen Kteyan, Jun-Ho Choy, Valeriy Sukharev, Matthias Kraatz, J. R. Lloyd:
A Novel Method for the Determination of Electromigration-Induced Void Nucleation Stresses. IRPS 2024: 10 - 2023
- [c8]Brian T. McGowan, Michal Rakowski, Seungman Choi:
Nickel Silicide Electromigration on Micro Ring Modulators for Silicon Photonics Technology. IRPS 2023: 1-8 - [c7]Zhuo-Jie Wu, Ping-Chuan Wang, Seungman Choi, Patrick Justison, Martin Gall, Jae Kyu Cho, Takako Hirokawa, Yusheng Bian, Thomas Houghton, Vaishnavi Karra, Dan Moy, Karen Nummy, Dave Riggs, Norman Robson, Ian Melville, Ken Giewont:
Self-aligned Fiber Attach on Monolithic Silicon Photonic Chips: Moisture Effect and Hermetic Seal. OFC 2023: 1-3 - 2022
- [j1]Yuki Taoka, Kohei Kawabata, Pasomphone Hemthavy, Seungman Choi
, Kunio Takahashi, Shigeki Saito:
Development of Bipolar Electrostatic Chuck with a Beam-Array Assembly Fabricated by Lithography. Int. J. Autom. Technol. 16(4): 471-477 (2022) - 2021
- [c6]Beom Young Jeong, Seungman Choi, Kyudong Park:
Heuristic Evaluation for Augmentative and Alternative Communication Application: A Case Study. ICTC 2021: 1240-1243 - [c5]Zhenjun Zhang, Matthias Kraatz, Meike Hauschildt, Seungman Choi, André Clausner, Ehrenfried Zschech, Martin Gall:
Strategy to Characterize Electromigration Short Length Effects in Cu/low-k Interconnects. IRPS 2021: 1-5
2010 – 2019
- 2019
- [c4]Lili Cheng, Seungman Choi, Sean P. Ogden, Teck Jung Tang, Robert Fox:
Robust BEOL MIMCAP for Long and Controllable TDDB Lifetime. IRPS 2019: 1-3 - 2018
- [c3]Seungman Choi, Cathryn Christiansen, Linjun Cao, James Zhang, Ronald Filippi, Tian Shen, Kong Boon Yeap, Sean P. Ogden, Haojun Zhang, Bianzhu Fu, Patrick Justison:
Effect of metal line width on electromigration of BEOL Cu interconnects. IRPS 2018: 4 - [c2]C. S. Premachandran, Seungman Choi, Salvatore Cimino, Thuy Tran-Quinn, Lloyd Burrell, Patrick Justison:
Reliability challenges for 2.5D/3D integration: An overview. IRPS 2018: 5 - 2015
- [c1]Kong Boon Yeap, Tian Shen, Galor Wenyi Zhang, Sing Fui Yap, Brian Holt, Arfa Gondal, Seungman Choi, San Leong Liew, Walter Yao, Patrick Justison:
Impact of electrode surface modulation on time-dependent dielectric breakdown. IRPS 2015: 2
Coauthor Index
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last updated on 2024-11-06 20:31 CET by the dblp team
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