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James P. McEvoy

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2010 – 2019

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2019
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Thibaut Heckmann, James P. McEvoy, Konstantinos Markantonakis, Raja Naeem Akram, David Naccache:
Removing epoxy underfill between neighbouring components using acid for component chip-off. Digit. Investig. 29: 198-209 (2019)

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