A hot embossing robot for bonding microfluidic chips: design, control and test.

Tue, 01 Jan 2019 00:00:00 +0100

Dongxu Zhang, Zhenyu Weng, Ya Zhang, Haozheng Dai, Jiageng Wu, Xiaoping Min, Shengxiang Ge:
A hot embossing robot for bonding microfluidic chips: design, control and test. RCAR 2019: 679-684