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2020 – today
- 2022
[c2]Dae-Hyun Kim
, Byungkyu Song, Hyun-A. Ahn, Woongjoon Ko, Sung-Geun Do, Seokjin Cho, Kihan Kim, Seung-Hoon Oh, Hye-Yoon Joo, Geuntae Park, Jin-Hun Jang, Yong-Hun Kim, Donghun Lee, Jaehoon Jung, Yongmin Kwon, Youngjae Kim, Jaewoo Jung, Seongil O, Seoulmin Lee, Jaeseong Lim, Junho Son, Jisu Min, Haebin Do, Jaejun Yoon, Isak Hwang, Jinsol Park, Hong Shim, Seryeong Yoon, Dongyeong Choi, Jihoon Lee, Soohan Woo, Eunki Hong, Junha Choi, Jae-Sung Kim, Sangkeun Han, Jong-Min Bang, Bokgue Park, Jang-Hoo Kim, Seouk-Kyu Choi, Gong-Heum Han, Yoo-Chang Sung, Wonil Bae, Jeong-Don Lim, Seungjae Lee, Changsik Yoo, Sang Joon Hwang, Jooyoung Lee:
A 16Gb 9.5Gb/S/pin LPDDR5X SDRAM With Low-Power Schemes Exploiting Dynamic Voltage-Frequency Scaling and Offset-Calibrated Readout Sense Amplifiers in a Fourth Generation 10nm DRAM Process. ISSCC 2022: 448-450- 2021
- [j1]Chang-Kyo Lee, Hyung-Joon Chi, Jin-Seok Heo, Junghwan Park, Jin-Hun Jang, Dongkeon Lee, Jaehoon Jung, Dong-Hun Lee, Dae-Hyun Kim, Kihan Kim, Sang-Yun Kim, Dukha Park, Youngil Lim, Geuntae Park, Seungjun Lee, Seungki Hong, Dae-Hyun Kwon, Isak Hwang, Byongwook Na, Kyungryun Kim, Seouk-Kyu Choi, Hye-In Choi, Hangi-Jung, Wonil Bae, Jeong-Don Ihm, Seung-Jun Bae, Nam Sung Kim, Jung-Bae Lee:
An 8.5-Gb/s/Pin 12-Gb LPDDR5 SDRAM With a Hybrid-Bank Architecture, Low Power, and Speed-Boosting Techniques. IEEE J. Solid State Circuits 56(1): 212-224 (2021) - 2020
- [c1]Hyung-Joon Chi, Chang-Kyo Lee, Junghwan Park, Jin-Seok Heo, Jaehoon Jung, Dongkeon Lee, Dae-Hyun Kim, Dukha Park, Kihan Kim, Sang-Yun Kim, Jinsol Park, Hyunyoon Cho, Sukhyun Lim, YeonKyu Choi, Youngil Lim, Daesik Moon, Geuntae Park, Jin-Hun Jang, Kyungho Lee, Isak Hwang, Cheol Kim, Younghoon Son, Gil-Young Kang, Kiwon Park, Seungjun Lee, Su-Yeon Doo, Chang-Ho Shin, Byongwook Na, Ji-Suk Kwon, Kyung Ryun Kim, Hye-In Choi, Seouk-Kyu Choi, Soobong Chang, Wonil Bae, Hyuck-Joon Kwon, Young-Soo Sohn, Seung-Jun Bae, Kwang-Il Park, Jung-Bae Lee:
22.2 An 8.5Gb/s/pin 12Gb-LPDDR5 SDRAM with a Hybrid-Bank Architecture using Skew-Tolerant, Low-Power and Speed-Boosting Techniques in a 2nd generation 10nm DRAM Process. ISSCC 2020: 382-384
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