BibTeX records: Jan Van Olmen

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@article{DBLP:journals/sensors/MalinowskiGMVFO17,
  author    = {Pawel E. Malinowski and
               Epimitheas Georgitzikis and
               Jorick Maes and
               Ioanna Vamvaka and
               Fortunato Frazzica and
               Jan Van Olmen and
               Piet De Moor and
               Paul Heremans and
               Zeger Hens and
               David Cheyns},
  title     = {Thin-Film Quantum Dot Photodiode for Monolithic Infrared Image Sensors},
  journal   = {Sensors},
  volume    = {17},
  number    = {12},
  pages     = {2867},
  year      = {2017},
  url       = {https://doi.org/10.3390/s17122867},
  doi       = {10.3390/s17122867},
  timestamp = {Sat, 19 Oct 2019 01:00:00 +0200},
  biburl    = {https://dblp.org/rec/journals/sensors/MalinowskiGMVFO17.bib},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/jssc/PlasLLMOTTLSKVCVSWLPBMCROPBORWDNAPABDTBM11,
  author    = {Geert Van der Plas and
               Paresh Limaye and
               Igor Loi and
               Abdelkarim Mercha and
               Herman Oprins and
               Cristina Torregiani and
               Steven Thijs and
               Dimitri Linten and
               Michele Stucchi and
               Guruprasad Katti and
               Dimitrios Velenis and
               Vladimir Cherman and
               Bart Vandevelde and
               Veerle Simons and
               Ingrid De Wolf and
               Riet Labie and
               Dan Perry and
               Stephane Bronckers and
               Nikolaos Minas and
               Miro Cupac and
               Wouter Ruythooren and
               Jan Van Olmen and
               Alain Phommahaxay and
               Muriel de Potter de ten Broeck and
               Ann Opdebeeck and
               Michal Rakowski and
               Bart De Wachter and
               Morin Dehan and
               Marc Nelis and
               Rahul Agarwal and
               Antonio Pullini and
               Federico Angiolini and
               Luca Benini and
               Wim Dehaene and
               Youssef Travaly and
               Eric Beyne and
               Paul Marchal},
  title     = {Design Issues and Considerations for Low-Cost 3-D {TSV} {IC} Technology},
  journal   = {{IEEE} J. Solid State Circuits},
  volume    = {46},
  number    = {1},
  pages     = {293--307},
  year      = {2011},
  url       = {https://doi.org/10.1109/JSSC.2010.2074070},
  doi       = {10.1109/JSSC.2010.2074070},
  timestamp = {Sun, 30 Aug 2020 01:00:00 +0200},
  biburl    = {https://dblp.org/rec/journals/jssc/PlasLLMOTTLSKVCVSWLPBMCROPBORWDNAPABDTBM11.bib},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/YangLLZROTVW10,
  author    = {Y. Yang and
               Riet Labie and
               F. Ling and
               C. Zhao and
               A. Radisic and
               Jan Van Olmen and
               Youssef Travaly and
               Bert Verlinden and
               Ingrid De Wolf},
  title     = {Processing assessment and adhesion evaluation of copper through-silicon
               vias (TSVs) for three-dimensional stacked-integrated circuit {(3D-SIC)}
               architectures},
  journal   = {Microelectron. Reliab.},
  volume    = {50},
  number    = {9-11},
  pages     = {1636--1640},
  year      = {2010},
  url       = {https://doi.org/10.1016/j.microrel.2010.07.019},
  doi       = {10.1016/j.microrel.2010.07.019},
  timestamp = {Sat, 22 Feb 2020 00:00:00 +0100},
  biburl    = {https://dblp.org/rec/journals/mr/YangLLZROTVW10.bib},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/isscc/PlasLMOTTLSKVSCVSWLPBMCROPBORWDNADTMB10,
  author    = {Geert Van der Plas and
               Paresh Limaye and
               Abdelkarim Mercha and
               Herman Oprins and
               Cristina Torregiani and
               Steven Thijs and
               Dimitri Linten and
               Michele Stucchi and
               Guruprasad Katti and
               Dimitrios Velenis and
               Domae Shinichi and
               Vladimir Cherman and
               Bart Vandevelde and
               Veerle Simons and
               Ingrid De Wolf and
               Riet Labie and
               Dan Perry and
               Stephane Bronckers and
               Nikolaos Minas and
               Miro Cupac and
               Wouter Ruythooren and
               Jan Van Olmen and
               Alain Phommahaxay and
               Muriel de Potter de ten Broeck and
               Ann Opdebeeck and
               Michal Rakowski and
               Bart De Wachter and
               Morin Dehan and
               Marc Nelis and
               Rahul Agarwal and
               Wim Dehaene and
               Youssef Travaly and
               Pol Marchal and
               Eric Beyne},
  title     = {Design issues and considerations for low-cost 3D {TSV} {IC} technology},
  booktitle = {{IEEE} International Solid-State Circuits Conference, {ISSCC} 2010,
               Digest of Technical Papers, San Francisco, CA, USA, 7-11 February,
               2010},
  pages     = {148--149},
  publisher = {{IEEE}},
  year      = {2010},
  url       = {https://doi.org/10.1109/ISSCC.2010.5434016},
  doi       = {10.1109/ISSCC.2010.5434016},
  timestamp = {Wed, 16 Oct 2019 14:14:55 +0200},
  biburl    = {https://dblp.org/rec/conf/isscc/PlasLMOTTLSKVSCVSWLPBMCROPBORWDNADTMB10.bib},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/AlapatiTOTVCJVMFWPZSMM09,
  author    = {Ramakanth Alapati and
               Youssef Travaly and
               Jan Van Olmen and
               Ricardo Cotrin Teixeira and
               Jan Vaes and
               Marc van Cauwenbergh and
               Anne Jourdain and
               Greet Verbinnen and
               Gino Marcuccilli and
               Glenn Florence and
               Shay Wolfling and
               Christine Pelissier and
               Haiping Zhang and
               Jaydeep Sinha and
               Andreas Machura and
               Irfan Malik},
  title     = {{TSV} metrology and inspection challenges},
  booktitle = {{IEEE} International Conference on 3D System Integration, 3DIC 2009,
               San Francisco, California, USA, 28-30 September 2009},
  pages     = {1--4},
  publisher = {{IEEE}},
  year      = {2009},
  url       = {https://doi.org/10.1109/3DIC.2009.5306573},
  doi       = {10.1109/3DIC.2009.5306573},
  timestamp = {Sun, 25 Oct 2020 01:00:00 +0200},
  biburl    = {https://dblp.org/rec/conf/3dic/AlapatiTOTVCJVMFWPZSMM09.bib},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/OlmenCDMHJKMRSTBS09,
  author    = {Jan Van Olmen and
               Jan Coenen and
               Wim Dehaene and
               Kristin De Meyer and
               Cedric Huyghebaert and
               Anne Jourdain and
               Guruprasad Katti and
               Abdelkarim Mercha and
               Michal Rakowski and
               Michele Stucchi and
               Youssef Travaly and
               Eric Beyne and
               Bart Swinnen},
  title     = {3D Stacked {IC} demonstrator using Hybrid Collective Die-to-Wafer
               bonding with copper Through Silicon Vias {(TSV)}},
  booktitle = {{IEEE} International Conference on 3D System Integration, 3DIC 2009,
               San Francisco, California, USA, 28-30 September 2009},
  pages     = {1--5},
  publisher = {{IEEE}},
  year      = {2009},
  url       = {https://doi.org/10.1109/3DIC.2009.5306600},
  doi       = {10.1109/3DIC.2009.5306600},
  timestamp = {Sun, 21 May 2017 01:00:00 +0200},
  biburl    = {https://dblp.org/rec/conf/3dic/OlmenCDMHJKMRSTBS09.bib},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
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