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2020 – today
- 2026
[j2]Anjali Agrawal
, Zhenghong Chen, Braden E. Desman, Jinhua Wang, Akiyoshi Tanaka, Fahim Foysal, Charlie D. Hess, Will Farrell, Jim Owens, Daniel S. Truesdell, Benton H. Calhoun:
kNOT: A 2-D Distributed Network-on-Textile Architecture With Direct Die-to-Yarn Integration of 0.6 × 2.15 mm2 SoC and bySPI Chiplets for Wearable Computing. IEEE J. Solid State Circuits 61(1): 103-115 (2026)- 2025
- [j1]Omar Faruqe, Zhenghong Chen, Suprio Bhattacharya, Md. Fahim Foysal, Samit Hasan, Jinhua Wang, Daniel S. Truesdell, Benton H. Calhoun:
A Compact, Power-Efficient, and On-the-Fly I2C-to-SPI Converter for Distributed E-Textile Systems. IEEE Trans. Circuits Syst. I Regul. Pap. 72(12): 7542-7552 (2025) - [c2]Omar Faruqe, Zhenghong Chen, Suprio Bhattacharya, Md. Fahim Foysal, Samit Hasan, Daniel S. Truesdell, Benton H. Calhoun:
A 0.36 mm2 On-the-Fly I2C-to-SPI Converter for E-Textile Applications. ISCAS 2025: 1-5 - [c1]Anjali Agrawal, Zhenghong Chen, Braden E. Desman, Jinhua Wang, Akiyoshi Tanaka, Fahim Foysal, Charlie D. Hess, Will Farrell, Jim Owens, Daniel S. Truesdell, Benton H. Calhoun:
37.2 A 2-Dimensional mm-Scale Network-on-Textiles (kNOTs) for Wearable Computing with Direct Die-to-Yarn Integration of 0.6×2.15mm2 SoC and bySPI Chiplets. ISSCC 2025: 608-610
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