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Ha-Seop Jeong

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2020 – today

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2026
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Myoungsu Chae, Sang Hee Lee, Eunbin Jo, Ha-Seop Jeong, Seeun Kim, Minsu Jang, Sungjun Hwang, Dong Jun Ji, Hee Joon Lee, Sun Ah Park, Jeong Kim, Doowon Lee:
Stress-Engineered SLIM-Cut of Ultra-Thin Silicon Using Saccharin-Modified Electroplated Ni Films. IEEE Access 14: 5567-5573 (2026)

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