default search action

combined dblp search
author search
venue search
publication search

ask others

D. Pinjala

> Home > Persons

Person information

Refine list

refinements active!

zoomed in on ?? of ?? records

view refined list in

export refined list as

showing all ?? records

2000 – 2009

see FAQ

What is the meaning of the colors in the publication lists?

2008
[j2]
- view
  authority control:
- export record
  dblp key:
  - journals/mr/ZhangKCTP08
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/ZhangKCTP08
Xiaowu Zhang, Kripesh Vaidyanathan, Tai Chong Chai, Teck Chun Tan, D. Pinjala:
Board level solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP). Microelectron. Reliab. 48(4): 602-610 (2008)
2004
[j1]
- view
  authority control:
- export record
  dblp key:
  - journals/mr/ZhangWLCMTPS04
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/ZhangWLCMTPS04
Xiaowu Zhang, Ee-Hua Wong, Charles Lee, Tai Chong Chai, Yiyi Ma, Poi-Siong Teo, D. Pinjala, Srinivasamurthy Sampath:
Thermo-mechanical finite element analysis in a multichip build up substrate based package design. Microelectron. Reliab. 44(4): 611-619 (2004)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.