10.6 A Hybrid-Bonded 12.1Tops/mm2 5 6-Core DNN Processor with 2.5Tb/s/mm2 3D Network on Chip.

Thu, 01 Jan 2026 00:00:00 +0100

Phil C. Knag, Gregory K. Chen, Shanshan Xie, Satish Yada, Wei Wu, Yu-Shiang Lin, Alexander Kashirin, Xiemei Meng, Russell Criss, Ana Sonia Leon, Carlos Tokunaga, Ram K. Krishnamurthy, James W. Tschanz:
10.6 A Hybrid-Bonded 12.1Tops/mm² 5 6-Core DNN Processor with 2.5Tb/s/mm² 3D Network on Chip. ISSCC 2026: 178-180