Improving Electrical and Thermal Performance of 650-V GaN E-HEMT Modules Using a Cover-All Meandered Thick-Copper (CAMT) Interconnection.

Thu, 01 Jan 2026 00:00:00 +0100

Jihwan Seong , A. Yeong Choi , Jaejin Jeon , Jang-Kwon Lim , Sang Won Yoon :
Improving Electrical and Thermal Performance of 650-V GaN E-HEMT Modules Using a Cover-All Meandered Thick-Copper (CAMT) Interconnection. IEEE Access 14: 15883-15893 (2026)