Alloying modification of Sn-Ag-Cu solders by manganese and titanium.

Thu, 01 Jan 2009 00:00:00 +0100

Li-Wei Lin, Jenn-Ming Song , Yi-Shao Lai, Ying-Ta Chiu, Ning-Cheng Lee, Jun-Yen Uan :
Alloying modification of Sn-Ag-Cu solders by manganese and titanium. Microelectron. Reliab. 49(3): 235-241 (2009)