Influence of trace alloying elements on the ball impact test reliability of SnAgCu solder joints.

Sun, 01 Jan 2012 00:00:00 +0100

Jenn-Ming Song , Yao-Ren Liu, Yi-Shao Lai, Ying-Ta Chiu, Ning-Cheng Lee:
Influence of trace alloying elements on the ball impact test reliability of SnAgCu solder joints. Microelectron. Reliab. 52(1): 180-189 (2012)