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ORCIDLei Guo 0013
Person information
- affiliation: Chang'an University, MOE Key Laboratory of Road Construction Technology and Equipment, Xi'an, China
- affiliation (PhD 2016): University of Toledo, Department of Mechanical Engineering, OH, USA
Other persons with the same name
- Lei Guo — disambiguation page
- Lei Guo 0001
![[0000-0003-1789-5202]](https://dblp.org/img/orcid-mark.12x12.png "0000-0003-1789-5202")
— Chinese Academy of Sciences, Academy of Mathematics and Systems Science / Institute of Systems Science, Beijing, China - Lei Guo 0002 — Northwestern Polytechnical University, School of Automation, Xi'an, China
- Lei Guo 0003 — Beihang University, School of Automation and Electronic Engineering (and 2 more)
- Lei Guo 0004 — Google Inc., Mountain View, CA, USA (and 1 more)
- Lei Guo 0005 — Chongqing University of Posts and Telecommunications, School of Communication and Information Engineering, China (and 2 more)
- Lei Guo 0006 — U.S. Food and Drug Administration, National Center for Toxicological Research, Jefferson, AR, USA
- Lei Guo 0007 — University of Queensland, School of Information Technology and Electrical Engineering, Brisbane, QLD, Australia
- Lei Guo 0008 — Shandong Normal University, School of Management Science and Industrial Engineering, Jinan, China (and 1 more)
- Lei Guo 0009 — Southwest Jiaotong University, Chengdu, China
- Lei Guo 0010 — Shenyang Jianzhu University, School of Mechanical Engineering, China
- Lei Guo 0011 — Beijing University of Posts and Telecommunications, School of Artificial Intelligence, Beijing, China (and 1 more)
- Lei Guo 0012 — Dalian University of Technology, School of Information and Communication Engineering, China (and 2 more)
- Lei Guo 0014 — Wuhan University, School of Geodesy and Geomatics, China
- Lei Guo 0015 — Hebei University of Technology, School of Electrical Engineering, State Key Laboratory of Reliability and Intelligence of Electrical Equipment, Tianjin, China
- Lei Guo 0016 — Shanghai Jiao Tong University, Sino-US Global Logistics Institute, China (and 2 more)
- Lei Guo 0017 — Boston University, Department of Computer Science, College of Communication, MA, USA
- Lei Guo 0018 — University of Electronic Science and Technology of China, School of Computer Science and Engineering, Chengdu, China
- Lei Guo 0019 — Taiyuan University of Technology, College of Information and Computer, Taiyuan, China
- Lei Guo 0020 — Wuyi University, Fujian Key Laboratory of Big Data Application and Intellectualization for Tea Industry, Nanping, China (and 1 more)
- Lei Guo 0021 — University of Jinan, School of Information Science and Engineering, Jinan, China
- Lei Guo 0022 — East China University of Science and Technology, School of Business, Shanghai, China
- Lei Guo 0023 — Zhengzhou University, School of Mechanical and Power Engineering, Zhengzhou, China
- Lei Guo 0024 — Tianjin University, Department of Communication Engineering, Tianjin, China
- Lei Guo 0025 — State Grid Henan Electric Power Research Institute, Zhengzhou, China
- Lei Guo 0026 — Central South University, School of Geosciences and Info-Physics, Laboratory of GeoHazards Perception, Cognition and Predication, Changsha, China
- Lei Guo 0027 — Beijing Institute of Pharmacology and Toxicology, Beijing, China
- Lei Guo 0028 — University of Pittsburgh, Department of Electrical and Computer Engineering, Pittsburgh, PA, USA
- Lei Guo 0029 — National University of Defense Technology, National Laboratory for Parallel and Distributed Processing, Changsha, China
- Lei Guo 0030 — Chinese Academy of Sciences, Institute of Electronics, Department of Space Microwave Remote Sensing System, Beijing, China
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2020 – today
- 2024
[j3]Xinrong Zhang, Ye-Hwa Chen, Dongsheng Zhang, Ruiying Zhao, Lei Guo:
A game-theoretic approach of cyberattack resilient constraint-following control for cyber-physical systems. Ad Hoc Networks 153: 103351 (2024)- [j2]Jizhuang Hui, Yaqian Zhang, Kai Ding, Lei Guo, Chun-Hsien Chen, Lihui Wang:
A multi-stage approach for desired part grasping under complex backgrounds in human-robot collaborative assembly. Adv. Eng. Informatics 62: 102778 (2024)
2010 – 2019
- 2019
- [j1]Lei Guo, Xinrong Zhang, Chul-Hee Lee, Ioan D. Marinescu, Yihe Zhang, Jizhuang Hui:
An Experimental Study on the Abrasive Machining Process of Electronic Substrate Material With A Novel Ultraviolet-Curable Resin Bond Diamond Lapping Plate. IEEE Access 7: 64375-64385 (2019)
Coauthor Index
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