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ORCIDZhong Chen 0004
Person information
- unicode name: 陈忠
- affiliation: Nanyang Technological University, School of Materials Science and Engineering, Singapore
Other persons with the same name
- Zhong Chen — disambiguation page
- Zhong Chen 0001
![[0000-0002-5785-2912]](https://dblp.org/img/orcid-mark.12x12.png "0000-0002-5785-2912")
— Peking University, School of Electronics Engineering and Computer Science, Beijing, China - Zhong Chen 0002 — South China University of Technology, School of Mechanical & Automotive Engineering, Guangzhou, China
- Zhong Chen 0003 — Xavier University of Louisiana, New Orleans, LA, USA (and 1 more)
- Zhong Chen 0005 — Xiamen University, Department of Communication Engineering, Fujian Key Laboratory of Plasma and Magnetic Resonance, China
- Zhong Chen 0006 — Sun Yat-sen University, School of Chemistry, Guangzhou, China
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2010 – 2019
- 2016
[j8]Adeline B. Y. Lim, Wei Jian Neo, Oranna Yauw, Bob Chylak, Chee Lip Gan, Zhong Chen:
Evaluation of the corrosion performance of Cu-Al intermetallic compounds and the effect of Pd addition. Microelectron. Reliab. 56: 155-161 (2016)- [j7]Vinod K. Murugan, Zhigang Jia, Govindo J. Syaranamual, Chee Lip Gan, Yizhong Huang, Zhong Chen:
Atmospheric corrosion resistance of electroplated Ni/Ni-P/Au electronic contacts. Microelectron. Reliab. 60: 84-92 (2016) - [j6]Adeline B. Y. Lim, Chris B. Boothroyd, Oranna Yauw, Bob Chylak, Chee Lip Gan, Zhong Chen:
Interfacial evolution and bond reliability in thermosonic Pd coated Cu wire bonding on aluminum metallization: Effect of palladium distribution. Microelectron. Reliab. 63: 214-223 (2016) - 2014
- [j5]Adeline B. Y. Lim, Andrew C. K. Chang, Oranna Yauw, Bob Chylak, Chee Lip Gan, Zhong Chen:
Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters. Microelectron. Reliab. 54(11): 2555-2563 (2014) - [j4]Ahmed Sharif, Chee Lip Gan, Zhong Chen:
Customized glass sealant for ceramic substrates for high temperature electronic application. Microelectron. Reliab. 54(12): 2905-2910 (2014) - 2013
- [j3]A. S. Ganapathi, Sunil C. Joshi, Zhong Chen:
Simulation of bleeder flow and curing of thick composites with pressure and temperature dependent properties. Simul. Model. Pract. Theory 32: 64-82 (2013) - 2011
- [j2]H. Xu, C. Liu, Vadim V. Silberschmidt, Zhong Chen, J. Wei, M. Sivakumar:
Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads: A TEM study of interfacial evolution. Microelectron. Reliab. 51(1): 113-118 (2011)
2000 – 2009
- 2009
- [j1]Xuefen Ong, Soon Wee Ho, Yue Ying Ong, Leong Ching Wai, Kripesh Vaidyanathan, Yeow Kheng Lim, David Yeo, Kai Chong Chan, Juan Boon Tan, Dong Kyun Sohn, Liang Choo Hsia, Zhong Chen:
Underfill selection methodology for fine pitch Cu/low-k FCBGA packages. Microelectron. Reliab. 49(2): 150-162 (2009)
Coauthor Index
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