Overview of Board-Level Solder Joint Reliability Modeling for Single Die and Stacked Die CSPs.

Thu, 01 Jan 2009 00:00:00 +0100

Z. W. Zhong, T. Y. Tee:
Overview of Board-Level Solder Joint Reliability Modeling for Single Die and Stacked Die CSPs. Proc. IEEE 97(1): 175-183 (2009)