Designing for reliability using a new Wafer Level Package structure.

Fri, 01 Jan 2010 00:00:00 +0100

Hendrik Pieter Hochstenbach, Willem D. van Driel, Dao-Guo Yang, Jeroen J. M. Zaal, E. Bagerman:
Designing for reliability using a new Wafer Level Package structure. Microelectron. Reliab. 50(4): 528-535 (2010)